UNLIMITED FREE
ACCESS TO THE WORLD'S BEST IDEAS

SUBMIT
Already a GlobalSpec user? Log in.

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

Customize Your GlobalSpec Experience

Select Your Free Newsletters

Industry Newsletters

Select Your Free Product Alerts

Finish!
Privacy Policy

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

BSI - BS EN 60749-21

Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability

inactive
Buy Now
Organization: BSI
Publication Date: 5 December 2005
Status: inactive
Page Count: 24
ICS Code (Semiconductor devices in general): 31.080.01

Document History

BS EN 60749-21
August 31, 2011
Semiconductor devices - Mechanical and climatic test methods Part 21: Solderability
A description is not available for this item.
BS EN 60749-21
December 5, 2005
Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
A description is not available for this item.

References

This document references:
IEC 60749-20 - Semiconductor devices – Mechanical and climatic test methods – Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
Published by IEC on August 1, 2020
This part of IEC 60749 provides a means of assessing the resistance to soldering heat of semiconductors packaged as plastic encapsulated surface mount devices (SMDs). This test is destructive.
This document references:
IEC 60749-15 - Semiconductor devices – Mechanical and climatic test methods – Part 15: Resistance to soldering temperature for through-hole mounted devices
Published by IEC on July 1, 2020
This part of IEC 60749 describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are...

Related Products

Searching for related products...

Advertisement