scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Three product assurance classes consisting of space application (device class V), military high reliability (device classes M and Q), and non-traditional military (device class N) with a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". For device class N, the user is cautioned to assure that the device is appropriate for the application environment. When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device classes N, Q, and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function Temperature range Speed 01 80486DX4 32-bit microprocessor −55°C to 125°C 75 MHz 02 80486DX4 32-bit microprocessor −55°C to 125°C 100 MHz 03 80486DX4 32-bit microprocessor −40°C to 125°C 75 MHz 04 80486DX4 32-bit microprocessor −40°C to 125°C 100 MHz 05 80486DX4 32-bit microprocessor −40°C to 110°C 75 MHz 06 80486DX4 32-bit microprocessor −40°C to 110°C 100 MHz

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 1/ N Certification and qualification to MIL-I-38535 with a non-traditional performance environment 2/ Q or V Certification and qualification to MIL-I-38535

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style X CMGA9-P168 168 Ceramic, pin grid array Y See Figure 1 196 Leaded chip carrier with unformed leads

The lead finish shall be as specified in MIL-I-38535 for device classes N, Q, and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Storage temperature range . . . . . . . . . . . . . . . . −65°C to +150°C Supply voltage with respect to ground range . . . . . . V_CC − 0.5 V to +4.6 V Voltage on any pin with respect to ground range . . . . . −0.5 V to V_CC + 0.5 V Maximum power dissipation (P_D) . . . . . . . . . .. . . 5 W Lead temperature (soldering, 10 seconds) . . . . . . . . 300°C Thermal resistance, junction-to-case (ΘJ_C): Case X . . . . . . . . . . . . . . . . . . . . . . . . See MIL-STD-1835 Case Y . . . . . . . . . . . . . . . . . . . . . . . . 2.5°C/W Maximum junction temperature (T_J) . . . . . . . . . . . . 150°C

Case operating temperature range . . . . . . . . . . . . See 1.2.2 Supply voltage, (V_CC) . . . . . . . . . . . . . . . . . . 3 3 V ±5%

Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) . . . . . . . . 98.5 percent

intended Use: