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DLA - SMD-5962-88752 REV A

MICROCIRCUIT, DIGITAL, BIPOLAR, ADVANCED SCHOTTKY, TTL, HEX INVERTER, MONOLITHIC SILICON

inactive
Organization: DLA
Publication Date: 9 March 1992
Status: inactive
Page Count: 9
scope:

This drawing describes device requirements for class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with complaint non-JAN devices".

The complete PIN shall be as shown in the following example:

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function 01 54F14 Hex inverter Schmitt trigger

The case outline(s) shall be as designated in appendix C of MIL-M-38510, and as follows:

Outline letter Case outline C D-1 (14-lead, .785" × .310" × .200"), dual-in-line package D F-2 (14-lead, .390" × .260" × .085"), flat package 2 C-2 (20-terminal, .358" × .358" × .100"), square chip carrier package

Supply voltage range 1/ - - - - - - - - - - - - - - −0.5 V dc to +7.0 V dc DC input voltage range - - - - - - - - - - - - - - - −0.5 V dc to +7.0 V dc DC input current range - - - - - - - - - - - - - - - −30 mA to +5.0 mA Voltage applied to output in high output state - - - −0.5 V dc to +VCC Current applied to output in low output state- - - - 40 mA Storage temperature range- - - - - - - - - - - - - - −65°C to +150°C Maximum power dissipation (PD) 2/- - - - - - - - - - 225 mW Lead temperature (soldering, 10 seconds) - - - - - - +260°C Thermal resistance, junction-to-case (ΘJC) - - - - - See MIL-M-38510, appendix C Junction temperature (TJ)- - - - - - - - - - - - - - +175°C

Supply voltage range (VCC) - - - - - - - - - - - - - 4.5 V dc to 5.5 V dc Maximum input clamp current (IIK)- - - - - - - - - - −18 mA Maximum high level output current (IOH)- - - - - - - −1.0 mA Maximum low level output current (IOL) - - - - - - - 20 mA Case operating temperature range (TC)- - - - - - - - −55°C to +125°C

intended Use:

Microcircuits conforming to this drawing are intended for use when military specifications do not exist and qualified military devices that will perform the required function are not available for... View More

Document History

June 8, 2020
MICROCIRCUIT, DIGITAL, BIPOLAR, ADVANCED SCHOTTKY, TTL, HEX INVERTER, MONOLITHIC SILICON
Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A.
November 17, 2015
MICROCIRCUIT, DIGITAL, BIPOLAR, ADVANCED SCHOTTKY, TTL, HEX INVERTER, MONOLITHIC SILICON
Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.
August 4, 2009
MICROCIRCUIT, DIGITAL, BIPOLAR, ADVANCED SCHOTTKY, TTL, HEX INVERTER, MONOLITHIC SILICON
Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.
June 11, 2003
MICROCIRCUIT, DIGITAL, BIPOLAR, ADVANCED SCHOTTKY, TTL, HEX INVERTER, MONOLITHIC SILICON
A description is not available for this item.
June 19, 2000
MICROCIRCUIT, DIGITAL, BIPOLAR, ADVANCED SCHOTTKY, TTL, HEX INVERTER, MONOLITHIC SILICON
Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.
SMD-5962-88752 REV A
March 9, 1992
MICROCIRCUIT, DIGITAL, BIPOLAR, ADVANCED SCHOTTKY, TTL, HEX INVERTER, MONOLITHIC SILICON
This drawing describes device requirements for class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with complaint non-JAN devices"....
January 18, 1989
MICROCIRCUIT, DIGITAL, BIPOLAR, ADVANCED SCHOTTKY, TTL, HEX INVERTER, MONOLITHIC SILICON
A description is not available for this item.

References

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