DLA - SMD-5962-77040 REV E
MICROCIRCUIT, LINEAR, NEGATIVE, FIXED, VOLTAGE REGULATOR, MONOLITHIC SILICON
| Organization: | DLA |
| Publication Date: | 4 May 1993 |
| Status: | inactive |
| Page Count: | 24 |
scope:
This drawing describes device requirements for class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices".
The complete PIN shall be as shown in the following example:
The device type(s) shall identify the circuit function as follows:
Device type Generic number Circuit function 01 7905/ LM120-5 Negative, voltage regulator, fixed −5 volts 03 7912/ LM120-12 Negative, voltage regulator, fixed −12 volts 04 7915/ LM120-15 Negative, voltage regulator, fixed −15 volts 05 7924/ LM120-24 Negative, voltage regulator, fixed −24 volts
The case outline(s) shall be as designated in MIL-STD-1835 and as follows:
Outline letter Descriptive designator Terminals Package style H GDFP1-F10 or CDFP2-F10 10 flat package P GDIP1-T8 or CDTP2-T8 8 dual in-line package X MACY1-X3 3 TO-5 can Y MBFM1-P2 2 TO-3 power transistor case 2 CQCC1-N20 20 leadless chip carrier package
The Lead finish shall be as specified in MIL-M-38510. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.
Input voltage (VIN): Device types 01, 03, 04 .............. −35 V Device type 05 ................... −40 V Storage temperature range .............. −65°C to +150°C Lead temperature (soldering, 10 seconds) ....... 300°C Power dissipation (PD): 1/, 2/ Case outline H ................... 0.675 W Case outline P ................... 1.050 W Case outline X ................... 2.0 W Case outline Y ................... 20.0 W Case outline 2 ................... 1.375 W Design output current (ID): Case outlines H, P, X, and 2 ............ 0.5 A Case outline Y ................... 1.0 A Thermal resistance, junction-to-case (ΘJC): Case outlines H, P, and 2 .............. See MIL-STD-1835 Case outline X ................... 15°C/W Case outline Y ................... 3°C/W
Thermal resistance, junction-to-ambient (ΘJA): Case outline H ................... 185°C/W Case outline P ................... 119°C/W Case outline X ................... 150°C/W Case outline Y ................... 35°C/W Case outline 2 ................... 65°C/W
Input voltage range (VIN): Device type 01 ................... −7 V −25 V Device type 03 ................... −15 V −32 V Device type 04 ................... −18.5 V −35 V Device type 05 ................... −28 V to −38 V Ambient operating temperature range (TA)......−55°C to +125°C
intended Use:
Microcircuits conforming to this drawing are intended for use when military specifications do not exist and qualified military devices that will perform the required function are not available for... View More
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