DLA - SMD-5962-93203
MICROCIRCUIT, LINEAR, 4:1 HIGH SPEED, ANALOG MULTIPLEXER, MONOLITHIC SILICON
Organization: | DLA |
Publication Date: | 15 October 1993 |
Status: | inactive |
Page Count: | 16 |
scope:
This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes Q and M) and space application (device class V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.
The PIN shall be as shown in the following example:
Device class M RHA marked devices shall meet the MIL-I-38535 appendix A specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
The device type(s) shall identify the circuit function as follows:
Device type Generic number Circuit function 01 CLC533 4:1 analog multiplexer, high speed
The device class designator shall be a single letter identifying the product assurance level as follows:
Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 Q or V Certification and qualification to MIL-I-38535
The case outline(s) shall be as designated in MIL-STD-1835 and as follows:
Outline letter Descriptive designator Terminals Package style E GDIP1-T16 or CDIP2-T16 16 Dual-in-line 2 CQCC1-N20 20 Square leadless chip carrier
The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein) for class M or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.
Positive supply voltage (+VS) . . . . . . . . . . . . −0.5 V to +7.0 V Negative supply voltage (−VS) . . . . . . . . . . . . +0.5 V to −7.0 V Differential voltage between any two grounds . . . . . 200 mV Analog input voltage range . . . . . . . . . . . . . . −VS to +VS Digital input voltage range . . . . . . . . . . . . . −VS to +VS Power dissipation (no load ) . . . . . . . . . . . . . 288 mW Output short circuit duration (output shorted to GND) . Infinite Junction temperature (TJ) . . . . . . . . . . . . . . . +175°C Storage temperature range . . . . . . . . . . . . . . −65°C to +150°C Lead temperature range (soldering 10 seconds) . . . . +300°C Thermal resistance, junction-to-case (θJC) . . . . . . See MIL-STD-1835 Thermal resistance, junction-to-ambient (θJA): Case E . . . . . . . . . . . . . . . . . . . . . . . 75°C/W Case 2 . . . . . . . . . . . . . . . . . . . . . . . 100°C/W
Positive supply voltage (+VS) . . . . . . . . . . . . . +5.0 V Negative supply voltage (−VS) . . . . . . . . . . . . . −5.2 V Differential voltage between any two grounds . . . . . 10 mV Analog input voltage range . . . . . . . . . . . . . . ±2 V AX input voltage range (TTL Mode) . . . . . . . . . . . 0 V to +5.0 V Select input voltage range (TTL Mode) . . . . . . . . . 0 V to +3.0 V AX input voltage range (ECL Mode) . . . . . . . . . . . 0 V to −2.0 V Select input voltage range (ECL Mode) . . . . . . . . . −2.0 V to 0 V CCOMP range . . . . . . . . . . . . . . . . . . . . . . 5 pF to 100 pF Ambient operating temperature range . . . . . . . . . . −55°C to +125°C
intended Use:
Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.
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