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BSI - BS EN 140401-801

Detail Specification: Fixed Low Power Non Wire-Wound Surface Mount (SMD) Resistors Rectangular Stability Classes 0,1; 0,25; 0,5; 1

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Organization: BSI
Publication Date: 16 August 2002
Status: inactive
Page Count: 28
ICS Code (Fixed resistors): 31.040.10

Document History

BS EN 140401-801
November 30, 2007
Detail specification: Fixed low power film SMD resistors - Rectangular - Stability classes 0,1; 0,25; 0,5; 1
A description is not available for this item.
BS EN 140401-801
November 30, 2007
Detail specification: Fixed low power film SMD resistors - Rectangular - Stability classes 0,1; 0,25; 0,5; 1
A description is not available for this item.
BS EN 140401-801
August 16, 2002
Detail Specification: Fixed Low Power Non Wire-Wound Surface Mount (SMD) Resistors Rectangular Stability Classes 0,1; 0,25; 0,5; 1
A description is not available for this item.
BS EN 140401-801
August 16, 2002
Detail Specification: Fixed Low Power Non Wire-Wound Surface Mount (SMD) Resistors Rectangular Stability Classes 0,1; 0,25; 0,5; 1
A description is not available for this item.

References

This document references:
IEC 60027-1 - Letter symbols to be used in electrical technology Part 1: General Amendment 1
Published by IEC on May 1, 1997
FOREWORD This amendment has been prepared by IEC technical committee 25: Quantities and units, and their letter symbols.
This document references:
IEC 60068-2-21 - Environmental testing – Part 2-21:Tests – Test U: Robustness of terminations and integral mounting devices
Published by IEC on January 1, 2012
This part of IEC 60068 is applicable to all electrical and electronic components whose terminations or integral mounting devices are liable to be submitted to stresses during normal assembly or...
This document references:
IEC 60068-2-58 - Environmental testing – Part 2-58: Tests – Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
Published by IEC on July 1, 2017
This part of IEC 60068 outlines test Td, applicable to surface mounting devices (SMD) This document provides procedures for determining the solderability, resistance to dissolution of metallization...
This document references:
HD 323.2.58 S1 - Environmental Testing - Part 2: Tests Test Td: Solderability, Resistance to Dissolution of Metallization and to Soldering Heat of Surface Mounting Devices (SMD)
Published by CENELEC on January 1, 1992
A description is not available for this item.
This document references:
IEC 60286-3 - Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes
Published by IEC on January 1, 2019
This part of IEC 60286 is applicable to the tape packaging of electronic components without leads or with lead stumps, intended to be connected to electronic circuits. It includes only those...
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