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BSI - BS EN 165000-3

Harmonized System of Quality Assessment for Electronic Components Film and Hybrid Integrated Circuits - Part 3: Self-Audit Checklist and Report for Film and Hybrid Integrated Circuit Manufacturers

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Organization: BSI
Publication Date: 15 October 1996
Status: active
Page Count: 104
ICS Code (Integrated circuits. Microelectronics): 31.200

Document History

BS EN 165000-3
October 15, 1996
Harmonized System of Quality Assessment for Electronic Components Film and Hybrid Integrated Circuits - Part 3: Self-Audit Checklist and Report for Film and Hybrid Integrated Circuit Manufacturers
A description is not available for this item.

References

This document references:
BS EN 165000-4 - Harmonized System of Quality Assessment for Electronic Components Film and Hybrid Integrated Circuits - Part 4: Customer Information, Product Assessment Level Schedules and Blank Detail Specification
Published by BSI on October 15, 1996
A description is not available for this item.
This document references:
BS EN 165000-1 - Harmonized System of Quality Assessment for Electronic Components Film and Hybrid Integrated Circuits - Part 1: Generic Specification Capability Approval Procedure
Published by BSI on October 15, 1996
Prescribes the quality assessment procedures and methods of test to be used for the assessment of hybrid circuits. To be read in conjunction with BS EN 165000-2,BS EN 165000-3,BS EN 165000-4
This document references:
BS EN 165000-2 - Harmonized System of Quality Assessment for Electronic Components Film and Hybrid Integrated Circuits - Part 2: Internal Visual Inspection and Special Tests
Published by BSI on October 15, 1996
A description is not available for this item.
This document references:
BS EN 165000-1 - Harmonized System of Quality Assessment for Electronic Components Film and Hybrid Integrated Circuits - Part 1: Generic Specification Capability Approval Procedure
Published by BSI on October 15, 1996
Prescribes the quality assessment procedures and methods of test to be used for the assessment of hybrid circuits. To be read in conjunction with BS EN 165000-2,BS EN 165000-3,BS EN 165000-4
This document references:
BS EN 100012 - Basic Specification: X-Ray Inspection of Electronic Components
Published by BSI on April 15, 1996
This specification describes the equipment and procedures to be used for the inspection of electronic components by means of radiography and radioscopy
This document references:
BS CECC 00016 - Basic Specification: Basic Requirements for the Use of Statistical Process Control (SPC) in the CECC System
Published by BSI on December 20, 1991
Requirements for application of SPC to improve the quality of process, products and services by continually reducing process variations.
This document references:
BS EN 165000-2 - Harmonized System of Quality Assessment for Electronic Components Film and Hybrid Integrated Circuits - Part 2: Internal Visual Inspection and Special Tests
Published by BSI on October 15, 1996
A description is not available for this item.
This document references:
BS EN 165000-4 - Harmonized System of Quality Assessment for Electronic Components Film and Hybrid Integrated Circuits - Part 4: Customer Information, Product Assessment Level Schedules and Blank Detail Specification
Published by BSI on October 15, 1996
A description is not available for this item.
This document is referenced by:
BS CECC 265001 - Harmonized System of Quality Assessment for Electronic Components Technology Approval Schedule: Film and Hybrid Integrated Circuits
Published by BSI on July 15, 1999
Specifies terms, definitions, symbols, quality system assessment and verification methods and other requirements relevant to the design, manufacture and supply in accordance with the CECC System for...
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