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BSI - BS EN 100012

Basic Specification: X-Ray Inspection of Electronic Components

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Organization: BSI
Publication Date: 15 April 1996
Status: active
Page Count: 12
ICS Code (Electronic components in general): 31.020
scope:

This specification describes the equipment and procedures to be used for the inspection of electronic components by means of radiography and radioscopy

Document History

BS EN 100012
April 15, 1996
Basic Specification: X-Ray Inspection of Electronic Components
This specification describes the equipment and procedures to be used for the inspection of electronic components by means of radiography and radioscopy

References

This document is referenced by:
BS EN 165000-3 - Harmonized System of Quality Assessment for Electronic Components Film and Hybrid Integrated Circuits - Part 3: Self-Audit Checklist and Report for Film and Hybrid Integrated Circuit Manufacturers
Published by BSI on October 15, 1996
A description is not available for this item.
This document is referenced by:
BS EN 165000-1 - Harmonized System of Quality Assessment for Electronic Components Film and Hybrid Integrated Circuits - Part 1: Generic Specification Capability Approval Procedure
Published by BSI on October 15, 1996
Prescribes the quality assessment procedures and methods of test to be used for the assessment of hybrid circuits. To be read in conjunction with BS EN 165000-2,BS EN 165000-3,BS EN 165000-4

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