scope:

This drawing describes device requirements for class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices".

The complete part number shall be as shown in the following example:

The device types shall identify the circuit function as follows:

Device type Generic number Circuit function Access time 01 9150-25 1024 × 4 high speed static R/W RAM 25 ns 02 9150-35 1024 × 4 high speed static R/W RAM 35 ns 03 9150-45 1024 × 4 high speed static R/W RAM 45 ns

The case outlines shall be as designated in appendix C of MIL-M-38510, and as follows:

Outline letter Case outline K F-6 (24-lead, .640" × .420" ×.090"), flat package L D-9 (24-lead, 1.280" ×.310" ×.200"), dual-in-line package X C-11 (28-terminal, .560" × .358" × .120"), rectangular chip carrier

Supply voltage range - - - - - - - - - - - - −0.5 V dc to +7.0 V dc Storage temperature range- - - - - - - - - - −65°C to +150°C Maximum power dissipation.(P_D) 1/ - - - - - 1.2 W Lead temperature (soldering, 10 seconds) - - +300°C Thermal resistance, junction-to-case (θ_JC): Cases K, L, and X- - - - - - - - - - - - - See MIL-M-38510, appendix C Junction temperature (T_J)- - - - - - - - - - +175°C DC output current- - - - - - - - - - - - - - 20 mA All signal voltages with respect to GND- - - −3.5 V dc to +7.0 V dc

Supply voltage (V_CC) - - - - - - - - - - - - 4.5 V dc minimum to 5.5 V dc maximum Minimum high level input voltage (V_IH) - - - 2.2 V dc Maximum low level input voltage (V_IL)- - - - 0.8 V dc Case operating temperature range (T_C)- - - - −55°C to +125°C

intended Use: