DLA - SMD-5962-94601 REV A

MICROCIRCUIT, DIGITAL, ADVANCED BIPOLAR CMOS, SCAN TEST DEVICE WITH 18-BIT BUS TRANSCEIVER, THREE-STATE OUTPUTS, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON

inactive

Organization:	DLA
Publication Date:	20 November 1995
Status:	inactive
Page Count:	25

scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes Q and M) and space application (device class V, and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device class M RHA marked devices shall meet the MIL-I-38535 appendix A specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function 01 54ABT18245 Scan test device with 18-bit bus transceiver, three-state outputs, TTL compatible inputs 02 54ABT18245A Scan test device with 18-bit bus transceiver, three-state outputs, TTL compatible inputs

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 Q or V Certification and qualification to MIL-I-38535

The case outline(s) shall be as designated in MIL-STD-1835, and as follows:

Outline letter Descriptive designator Terminals Package style X GDFP1-F56 56 Flat pack

The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein) for class M or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Supply voltage range (V_CC) - - - - - - - - - - - - - - - - - - - - - −0.5 V dc to +7.0 V dc DC input voltage range (I/O ports) (V_IN) - - - - - - - - - - - - - - −0.5 V dc to +5.5 V dc 4/ DC input voltage range (except I/O ports) (V_IN) - - - - - - - - - - - −0.5 V dc to +7.0 V dc 4/ DC output voltage range (V_OUT) - - - - - - - - - - - - - - - - - - - −0.5 V dc to +5.5 V dc 4/ DC output current (I_OL) (per output) - - - - - - - - - - - - - - - - +96 mA DC input clamp current (I_IK) (V_IN < 0.0 V ) - - - - - - - - - - - - - −18 mA DC output clamp current (I_OK) (V_OUT < 0.0 V) - - - - - - - - - - - - −50 mA V_CC current (I_VCC) Device 01 - - - - - - - - - - - - - - - - - - - - - - - - - - - - - +581 mA Device 02 - - - - - - - - - - - - - - - - - - - - - - - - - - - - - +576 mA Ground current (I_GND) Device 01 - - - - - - - - - - - - - - - - - - - - - - - - - - - - - +1190 mA Device 02 - - - - - - - - - - - - - - - - - - - - - - - - - - - - - +1152 mA Storage temperature range (T_STG) - - - - - - - - - - - - - - - - - - −65°C to +150°C Lead temperature (soldering, 10 seconds) - - - - - - - - - - - - - - +300°C Thermal resistance, junction-to-case (Θ_JC) - - - - - - - - - - - - - See MIL-STD-1835 Junction temperature (T_J) - - - - - - - - - - - - - - - - - - - - - - +175°C Maximum power dissipation T_A = +55°C(P_D)- - - - - - - - - - - - - - - 950 mW 5/

Supply voltage range (V_CC) - - - - - - - - - - - - - - - - - - - - - +4.5 V dc to +5.5 V dc Input voltage range (V_IN) - - - - - - - - - - - - - - - - - - - - - +0.0 V dc to V_CC Output voltage range (V_OUT) - - - - - - - - - - - - - - - - - - - - - +0.0 V dc to V_CC Maximum low level input voltage (V_IL) - - - - - - - - - - - - - - - - 0.8 V Minimum high level input voltage (V_IH) - - - - - - - - - - - - - - - 2.0 V Maximum high level output current (I_OH) - - - - - - - - - - - - - - - −24 mA Maximum low level output current (I_OL) - - - - - - - - - - - - - - - +48 mA Maximum input rise or fall rate (Δt/ΔV) - - - - - - - - - - - - - - - 10 ns/V Minimum setup time (t_s): mAn, mBn, mDIR, or mOE before TCK↑ - - - - - - - - - - - - - - - - 9.5 ns TDI before TCK↑ - - - - - - - - - - - - - - - - - - - - - - - - - - 4.5 ns TMS before TCK↑ - - - - - - - - - - - - - - - - - - - - - - - - - - 3.6 ns Minimum hold time (t_h): mAn, mBn, mDIR, or mOE after TCK↑ - - - - - - - - - - - - - - - - - 0.7 ns TDI after TCK↑ - - - - - - - - - - - - - - - - - - - - - - - - - - 0.0 ns TMS after TCK↑ - - - - - - - - - - - - - - - - - - - - - - - - - - 0.5 ns Minimum pulse width, TCK high or low (t_r) - - - - - - - - - - - - - - 8.1 ns Minimum delay time, power-up to TCK↑ (t_d) - - - - - - - - - - - - - - 50.0 ns 6/ Minimum rise time, V_CC power-up (t_r) - - - - - - - - - - - - - - - - 1.0 µs 6/ Maximum TCK frequency (f_CLK) - - - - - - - - - - - - - - - - - - - - 50 MHz Case operating temperature range (T_C) - - - - - - - - - - - - - - - - −55°C to +125°C

Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) - - - - - - - - - - - - XX percent 7/

intended Use:

Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.

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