scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes B, Q, and M) and space application (device classes S and V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of radiation hardness assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device classes M, B, and S RHA marked devices shall meet the MIL-M-38510 specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Dynamic Device type Generic number 1/ Circuit function Access time operating current 01 4k × 8 dual port CMOS SRAM 70 ns 270 mA 02 4k × 8 dual port CMOS SRAM 70 ns 220 mA 03 4k × 8 dual port CMOS SRAM 55 ns 270 mA 04 4k × 8 dual port CMOS SRAM 55 ns 220 mA 05 4k × 8 dual port CMOS SRAM 45 ns 280 mA 06 4k × 8 dual port CMOS SRAM 45 ns 240 mA 07 4k × 8 dual port CMOS SRAM 35 ns 300 mA 08 4k × 8 dual port CMOS SRAM 35 ns 260 mA

The device class designator shall be a single letter identifying the product assurance level (see 6.6 herein) as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 B or S Certification and qualification to MIL-M-38510 Q or V Certification and qualification to MIL-I-38535

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style X GDIP1-T48 or CDIP2-T48 48 Dual-in-line package Y See figure 1 48 Square chip carrier package

The lead finish shall be as specified in MIL-M-38510 for classes M, B, and S or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Supply voltage range - - - - - - - - - - - - - −0.5 V dc to +7.0 V dc Input voltage - - - - - - - - - - - - - - - - −0.5 V dc to +6.0 V dc DC output current - - - - - - - - - - - - - - −50 mA Storage temperature range- - - - - - - - - - - −65°C to +150°C Maximum power dissipation (P_D) - - - - - - - - 2.0 W Lead temperature (soldering, 10 seconds) - - - +260°C Thermal resistance, junction-to-case (θ_JC) - - See MIL-STD-1835 Junction temperature (T_J) - - - - - - - - - - +150°C 3

Supply voltage range (V_CC) - - - - - - - - - - −4.5 V dc to 5.5 V dc High level input voltage range (V_IH) - - - - - −2.2 V dc to 6.0 V dc Low level input voltage range (V_IL)- - - - - - −0.5 V dc to 0.8 V dc 4/ Case operating temperature range T_C) - - - - - −55°C to +125°C

Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012)- - - - - -5/ percent

intended Use: