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BSI - BS EN 61760-1

Surface Mounting Technology - Part 1: Standard Method for the Specification of Surface Mounting Components (SMDs)

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Organization: BSI
Publication Date: 15 January 1999
Status: inactive
Page Count: 28
ICS Code (Electronic components in general): 31.020
scope:

Gives a reference set of process conditions and related test conditions to be used when compiling component specifications.

Document History

BS EN IEC 61760-1
September 30, 2020
Surface Mounting Technology Part 1: Standard method for the specification of surface mounting components (SMDs)
A description is not available for this item.
BS EN 61760-1
September 29, 2006
Surface Mounting Technology - Part 1: Standard Method for the Specification of Surface Mounting Components (SMDs)
A description is not available for this item.
BS EN 61760-1
January 15, 1999
Surface Mounting Technology - Part 1: Standard Method for the Specification of Surface Mounting Components (SMDs)
Gives a reference set of process conditions and related test conditions to be used when compiling component specifications.

References

This document references:
BS EN IEC 60286-5 - Packaging of components for automatic handling Part 5: Matrix trays
Published by BSI on June 30, 2018
A description is not available for this item.
This document references:
IEC 60286-4 - Packaging of components for automatic handling – Part 4: Stick magazines for electronic components encapsulated in packages of different forms
Published by IEC on July 1, 2013
This part of IEC 60286 is applicable to stick magazines (including end stoppers) intended to be used for storage of electronic components, for transport from the manufacturer to the customer and for...
This document references:
IEC 60068-2-45 - Basic Environmental Testing Procedures Part 2: Tests Test XA and Guidance: Immersion in Cleaning Solvents
Published by IEC on January 1, 1980
A description is not available for this item.
This document references:
IEC 60068-2-20 - Environmental testing – Part 2-20: Tests – Tests Ta and Tb: Test methods for solderability and resistance to soldering heat of devices with leads
Published by IEC on March 1, 2021
This part of IEC 60068 outlines Tests Ta and Tb, applicable to devices with leads and leads themselves. Soldering tests for surface mounting devices (SMD) are described in IEC 60068-2-58. This...
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