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BSI - BS EN 61760-1

Surface Mounting Technology - Part 1: Standard Method for the Specification of Surface Mounting Components (SMDs)

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Organization: BSI
Publication Date: 29 September 2006
Status: inactive
Page Count: 34
ICS Code (Electronic components in general): 31.020
ICS Code (Mechanical structures for electronic equipment): 31.240

Document History

BS EN IEC 61760-1
September 30, 2020
Surface Mounting Technology Part 1: Standard method for the specification of surface mounting components (SMDs)
A description is not available for this item.
BS EN 61760-1
September 29, 2006
Surface Mounting Technology - Part 1: Standard Method for the Specification of Surface Mounting Components (SMDs)
A description is not available for this item.
BS EN 61760-1
January 15, 1999
Surface Mounting Technology - Part 1: Standard Method for the Specification of Surface Mounting Components (SMDs)
Gives a reference set of process conditions and related test conditions to be used when compiling component specifications.

References

This document references:
IEC 60286-3 - Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes
Published by IEC on January 1, 2019
This part of IEC 60286 is applicable to the tape packaging of electronic components without leads or with lead stumps, intended to be connected to electronic circuits. It includes only those...
This document references:
IEC 60286-6 - Packaging of components for automatic handling Part 6: Bulk case packaging for surface mounting components
Published by IEC on February 1, 2004
A description is not available for this item.
This document references:
IEC 61340-5-3 - Electrostatics - Part 5-3: Protection of electronic devices from electrostatic phenomena - Properties and requirements classification for packaging intended for electrostatic discharge sensitive devices
Published by IEC on July 1, 2015
This part of IEC 61340 defines the ESD protective packaging properties needed to protect electrostatic discharge sensitive devices (ESDS) through all phases of production, rework/maintenance,...
This document references:
IEC 60068-2-45 - Basic Environmental Testing Procedures Part 2: Tests Test XA and Guidance: Immersion in Cleaning Solvents
Published by IEC on January 1, 1980
A description is not available for this item.
This document references:
IEC 60068-2-77 - Environmental Testing - Part 2-77: Tests - Test 77: Body Strength and Impact Shock
Published by IEC on January 1, 1999
Scope and object This part of IEC 60068 provides test methods applicable to surface mounting devices (SMDs) made of glass or sintered materials such as capacitors, resistors and inductors...
This document is referenced by:
BS EN 61810-1 - Electromechanical elementary relays Part 1: General and safety requirements
Published by BSI on April 30, 2015
A description is not available for this item.
This document is referenced by:
BS EN 61188-5-4 - Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides
Published by BSI on December 31, 2007
A description is not available for this item.
This document is referenced by:
BS EN 62137-1-5 - Surface mounting technology - Environmental and endurance test methods for surface mount solder joints - Part 1-5: Mechanical shear fatigue test
Published by BSI on July 31, 2009
A description is not available for this item.
This document is referenced by:
BS EN 140402-801 - Detail specification: Fixed low power wirewound surface mount (SMD) resistors - Rectangular - Stability classes 0,5; 1; 2
Published by BSI on April 30, 2015
A description is not available for this item.
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