IPC-TM-650 2.4.44
Solder Paste - Tack Test
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| Organization: | IPC |
| Publication Date: | 1 January 1995 |
| Status: | active |
| Page Count: | 1 |
scope:
This test is to determine the ability of a printed pattern of solder paste to retain a probe placed in the solder paste by measuring the force required to separate the probe from the paste. Time between printing and probe placement are progressively increased to simulate variables in a manufacturing process.
Document History
IPC-TM-650 2.4.44
January 1, 1995
Solder Paste - Tack Test
This test is to determine the ability of a printed pattern of solder paste to retain a probe placed in the solder paste by measuring the force required to separate the probe from the paste. Time...
January 1, 1995
Solder Paste - Tack Test
A description is not available for this item.