IPC - TM-650 2.6.2
Moisture Absorption, Flexible Printed Wiring
inactive
| Organization: | IPC |
| Publication Date: | 1 May 1998 |
| Status: | inactive |
| Page Count: | 1 |
scope:
This test method defines the procedures to determine the moisture absorption properties of copper clad or unclad flexible dielectrics.
Document History
May 1, 2022
Moisture Absorption, Flexible Printed Wiring
This test method defines the procedures to determine the moisture absorption properties of metal clad or unclad flexible dielectrics.
February 1, 2012
Moisture Absorption, Flexible Printed Wiring
A description is not available for this item.
TM-650 2.6.2
May 1, 1998
Moisture Absorption, Flexible Printed Wiring
This test method defines the procedures to determine the moisture absorption properties of copper clad or unclad flexible dielectrics.
March 1, 1986
Water Absorption, Flexible Printed Wiring
A description is not available for this item.