scope:

This drawing describes device requirements for class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with complaint non-JAN devices".

The complete part number shall be as shown in the following example:

The device types shall identify the circuit function as follows:

Device type Generic number Circuit function Access time 01 (See 6.6) 2K 8 low power CMDS SRAM 35 ns 02 (See 6.6) 2K 8 low power CMDS SRAM 25 ns

The case outlines shall be as designated in appendix C of MIL-M-38510, and as follows:

Outline letter Case outline J D-3 (24-lead, 1.290" × .610" × .225"), dual-in-line package K F-6 (24-lead, .640" × .420" × .090"), flat package L D-9 (24-Lead, 1.280" × .310" × .200"), dual-in-line package X C-12 (32-terminal, .560" × .458" × .120"), rectangular chip carrier package Y Figure 1 (24-lead, .308" × .408" × .120"), rectangular chip carrier package 3 C-4 (28-terminal, .460" × .460" × .100"), square chip carrier package

Supply voltage range (V_CC) - - - - - - - - - - - - - −0.5 V dc to 7 V dc Input voltage range 2/- - - - - - - - - - - - - - - 0.5 V dc to V_CC +0.5 V dc Output voltage range in high impedance state - - - - −0.5 V dc to 7 V dc Output current - - - - - - - - - - - - - - - - - - - 20 mA Storage temperature range - - - - - - - - - - - - - −65°C to +150°C Power dissipation (P_D) - - - - - - - - - - - - - - - 1 W Lead temperature (soldering, 10 seconds) - - - - - - +275°C Junction temperature (T_J)- - - - - - - - - - - - - - +175°C Thermal resistance, junction-to-case (θ_JC) - - - - - See MIL-M-38510, appendix C

Supply voltage range (V_CC) - - - - - - - - - - - - - 4.5 V dc to minimum to 5.5 V dc maximum High level input voltage (V_IH) - - - - - - - - - - - 2.2 V dc minimum to V_CC + 0.5 V dc maximum Low level input voltage (V_IL) 2/ - - - - - - - - - −0.5 V dc minimum to 0.8 V dc maximum Case operating temperature range (T_C) - - - - - - - −55°C to +125°C

intended Use: