scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes B, Q, and M) and space application (device classes S and V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device classes M, B, and S RHA marked devices shall meet the MIL-M-38510 specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function 01 96002-33 96-bit IEEE floating point dual port processor

The device class designator shall be a single Letter identifying the product assurance Level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 B or S Certification and qualification to MIL-M-38510 Q or V Certification and qualification to MIL-I-38535

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style X CMGA10-P223 223 Pin grid array package

The lead finish shall be as specified in MIL-M-38510 for classes M, B, and S or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Supply voltage range . . . . . . . . . . . . . . . . . −0.3 V dc to +7.0 V dc Storage temperature range . . . . . . . . . . . . . . . −65°C to +150°C Lead temperature (soldering, 5 seconds) . . . . . . . . +270°C Junction temperature (T_J) . . . . . . . . . . . . . . . +150°C Power dissipation (P_D) . . . . . . . . . . . . . . . . 3.1 W Thermal resistance, junction-to-case (θ_JC) . . . . . . +5.0°C/W

Supply voltage range (V_CC) . . . . . . . . . . . . . . 4.75 V dc to 5.25 V dc Input high voltage range (V_IH); CLK . . . . . . . . . . . . . . . . . . . . . . . . 4.0 V dc to V_CC [R bar][E bar][S bar] . . . . . . . . . . . . . . . . . . . . . . . . 2.5 V dc to V_CC MODA, MODB, and MODC . . . . . . . . . . . . . . . . 3.5 V dc to V_CC All other inputs . . . . . . . . . . . . . . . . . . 2.0 V dc to V_CC Input low voltage range (V_IL); CLK . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V dc to +0.6 V dc All other inputs . . . . . . . . . . . . . . . . . . −0.5 V dc to +0.8 V dc Minimum high level output voltage (V_OH); I_OH = −10 µA . . . . . . . . . . . . . . . . . . . . V_CC − 0.1 V dc I_OH = −0.4 mA . . . . . . . . . . . . . . . . . . . 2.4 V dc Maximum low level output voltage (V_OL); I_OL = 10 µA . . . . . . . . . . . . . . . . . . . . 0.1 V dc I_OL = 3.2 mA . . . . . . . . . . . . . . . . . . . . 0.4 V dc Frequency of operation (f_OP) . . . . . . . . . . . . . 33.3 MHz Case operating temperature range (T_C) . . . . . . . . . −55°C to +125°C

intended Use: