IPC - TM-650 2.6.3.6
Surface Insulation Resistance - Fluxes - Telecommunications
active, Most Current
| Organization: | IPC |
| Publication Date: | 1 January 2004 |
| Status: | active |
| Page Count: | 3 |
scope:
This test method is used to characterize the effects of flux residues on electrical performance by determining the degradation of electrical insulation resistance under conditions of high temperature and humidity. This method, in conjunction with the supporting documentation in IPC-J-STD-004, is intended to be equivalent to Telcordia Technologies GR-78-CORE, Section 13.1, (Corrosiveness of Soldering Fluxes) and is used primarily by telecommunications companies to qualify the candidate flux or solder paste.
Document History
TM-650 2.6.3.6
January 1, 2004
Surface Insulation Resistance - Fluxes - Telecommunications
This test method is used to characterize the effects of flux residues on electrical performance by determining the degradation of electrical insulation resistance under conditions of high temperature...