scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes B, Q, and M) and space application(device classes S and V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device classes M, B, and S RHA marked devices shall meet the MIL-M-38510 specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function 01 16C30 Universal serial controller

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation. M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 B or S Certification and qualification to MIL-I-38510 Q or V Certification and qualification to MIL-I-38535

The case outline(s)shall be as designated in MIL-STD-1835 and as follows:

Outline Letter Descriptive designator Terminals Package style X CMGA3-P68 68 pin grid array

The lead finish shall be as specified in MIL-M-38510 for classes M, B, and S or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Supply voltage range . . . . . . . . . . . . . . . . . . −0.3 V dc to +7.0 V dc Voltages on all pins with respect to V_SS (except V_CC) . . −0.3 V dc to V_CC + 0.3 V dc Power dissipation (P_D) . . . . . . . . . . . . . . . . . 350 mW Lead temperature (soldering, 10 seconds) . . . . . . . . +270°C Thermal resistance, junction-to-case (Θ_JC) . . . . . . . See MIL-STD-1835 Junction temperature (T_J) . . . . . . . . . . . . . . . . +145°C Storage temperature . . . . . . . . . . . . . . . . . . . −65°C to +150°C

Ambient operating temperature range (T_A) . . . . . . . . −55°C to +125°C Supply voltage (V_CC) . . . . . . . . . . . . . . . . . . 4.5 V dc to 5.5 V dc

Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) . . . . . . XX percent 2/

intended Use: