scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes Q and M) and space application (device class V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device class M RHA marked devices shall meet the MIL-I-38535 appendix A specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA Levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function 01 TLE2141 Low noise, high speed single operational amplifier 02 TLE2141A Low noise, high speed single operational amplifier 03 TLE2142 Low noise, high speed dual operational amplifier 04 TLE2142A Low noise, high speed dual operational amplifier 05 TLE2144 Low noise, high speed quad operational amplifier 06 TLE2144A Low noise, high speed quad operational amplifier

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 Q or V Certification and qualification to MIL-I-38535

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminates Package style C GDIP1-T14 or CDIP2-T14 14 Dual-in-line H GDFP1-F10 10 Flat pack P GDIP1-T8 or CDIP2-T8 8 Dual-in-line 2 CQCC1-N20 20 Square leadless chip carrier

The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein) for class M or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Positive supply voltage (+V_CC) . . . . . . . . . . . . . +22 V 2/ Negative supply voltage (−V_CC) . . . . . . . . . . . . . −22 V 2/ Differential input voltage . . . . . . . . . . . . . . . . ±44 V 3/ Input voltage range (V_IN) (any input). . . . . . . . . . . +V_CC to −V_CC −0.3 V Input current (I_IN) (each input) . . . . . . . . . . . . . ±1 mA Output current (I_OUT) . . . . . . . . . . . . . . . . . . ±80 mA Total current into +V_CC terminal . . . . . . . . . . . . . 160 mA Total current into −V_CC terminal . . . . . . . . . . . . . 160 mA Duration of short circuit current at (or below) 25°C . . . Unlimited 4/ Power dissipation (P_D) (T_A ≤ 25°C): Cases E and 2 . . . . . . . . . . . . . . . . . . . . . 1375 mW 5/ Case P . . . . . . . . . . . . . . . . . . . . . . . . . 1050 mW 5/ Storage temperature range. . . . . . . . . . . . . . . . . −65°C to 150°C Case temperature for 60 seconds: (Case 2). . . . . . . . . +260°C Lead temperature, 1.6 mm (1/16 inch) from case for 60 seconds: (Cases E and P) . . . . . . . . . . . . . . . +300°C Junction temperature (T_J) . . . . . . . . . . . . . . . . +150°C Thermal resistance, junction-to-case (ΘJ_C) . . . . . . . . See MIL-STD-1835

Supply voltage (±V_CC) . . . . . . . . . . . . . . . . ±2 V minimum, ±22 V maximum Common-mode input voltage (V_IC): With ±V_CC = ±5 V . . . . . . . . . . . . . . . . . 0 V minimum, 2.7 V maximum With ±V_CC = ±15 V . . . . . . . . . . . . . . . . . −15 V minimum, 12.7 V maximum Ambient operating free-air temperature (T_A). . . . . . −55°C to +125°C

intended Use: