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DLA - SMD-5962-87755

MICROCIRCUIT, DIGITAL, BIPOLAR, BUFFERED REGISTERS, MONOLITHIC SILICON

inactive
Organization: DLA
Publication Date: 19 January 1988
Status: inactive
Page Count: 18
scope:

This drawing describes device requirements for class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices".

The complete part number shall be as shown in the following example:

The device types shall identify the circuit function as follows:

Device type Generic number Circuit function 01 29821A 10-wide buffered register 02 29823A 9-wide buffered register 03 29825A 8-wide buffered register 04 29921A 10-wide buffered register with rotated die 05 29923A 9-wide buffered register with rotated die 06 29925A 8-wide buffered register with rotated die

The case outlines shall be as designated in appendix C of MIL-M-38510, and as follows:

Outline letter Case outline L D-9 (24-lead, ¼" × 1 ¼"), dual-in-line package K F-6 (24-lead, ⅜" × ⅝"), flat package 3 C-4 (28-terminal, .450" × .450") square chip carrier package

Supply voltage range- - - - - - - - - - - - - - −0.5 V dc to +7.0 V dc Input voltage range - - - - - - - - - - - - - - −1.5 V dc to +6.0 V dc Storage temperature range - - - - - - - - - - - −65°C to +150°C DC output voltage - - - - - - - - - - - - - - - −0.5 V dc to +5.5 V dc DC output current into output - - - - - - - - - +100 mA DC output current out of output - - - - - - - - −50 mA DC input current into input - - - - - - - - - - −30 mA to +5.0 mA Maximum power dissipation PD (1/) - - - - - - - - - 2.0 W Lead temperature (soldering, 10 seconds) +300°C Thermal resistance, Junction-to-case (θJC)- - - - - See MIL-M-38510, appendix C Junction temperature (TJ)- - - - - - - - - - - - - +150°C

Supply voltage (VCC)- - - - - - - - - - - - +4.5 V dc minimum to +5.5 V dc maximum Minimum high level input voltage (VIH)- - - 2.0 V dc Maximum low level input voltage (VIL) - - - 0.8 V dc Case operating temperature range (TC) - - - −55°C to +125°C

intended Use:

Microcircuits conforming to this drawing are intended for use when military specifications do not exist and qualified military devices that will perform the required function are not available for... View More

Document History

August 17, 2017
MICROCIRCUIT, DIGITAL, BIPOLAR, BUFFERED REGISTERS, MONOLITHIC SILICON
This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes...
September 12, 2011
MICROCIRCUIT, DIGITAL, BIPOLAR, BUFFERED REGISTERS, MONOLITHIC SILICON
This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes...
June 30, 2005
MICROCIRCUIT, DIGITAL, BIPOLAR, BUFFERED REGISTERS, MONOLITHIC SILICON
This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes...
March 5, 2001
MICROCIRCUIT, DIGITAL, BIPOLAR, BUFFERED REGISTERS, MONOLITHIC SILICON
This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes...
SMD-5962-87755
January 19, 1988
MICROCIRCUIT, DIGITAL, BIPOLAR, BUFFERED REGISTERS, MONOLITHIC SILICON
This drawing describes device requirements for class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices"....

References

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