scope:

This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (HR) levels are reflected in the PIN.

The PIN is as shown in the following example:

Device classes Q and V HR marked devices meet the MIL-PRF-38535 specified HR levels and are marked with the appropriate HR designator. Device class M HR marked devices meet the MIL-PRF-38535, appendix A specified HR levels and are marked with the appropriate HR designator. A dash (-) indicates a non-HR device.

The device type identify the circuit function as follows:

Device type Generic number Circuit function 01 54AHCT14 Hex Schmitt-Trigger Inverter, TTL compatible inputs

The device class designator is a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535

The case outline are as designated in MIL-STD-1 835 and as follows:

Outline letter Descriptive designator Terminals Package style C GDIPL-T14 or CDIP2-T14 14 Dual-in-line D GDFP1-F14 or CDFP2-F14 14 Flat pack 2 CQCCl-N20 20 Square leadless chip carrier

The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M.

Supply voltage range (V_CC) .................................. −0.5 V dc to +7.0 V dc DC input voltage range (V_IN) ................................ −0.5 V dc to +7.0 V dc 4/ DC output voltage range (V_OUT) .............................. −0.5 V dc to +7.0 V dc 4/ DC input clamp current (I_IK)(V_IN < 0.0 or V_IN > V_CC) ........ −20 mA DC output clamp current (I_OK)(V_OUT < 0.0 or V_OUT > V_CC) ..... −20 mA Continuous output current(I_O)(V_OUT = 0 to V_CC) .............. ±25 mA Continuous current through V_CC or GND ....................... ±50 mA Storage temperature rang (T_STG) ............................. −65°C to +150°C Lead temperature (soldering, 10 seconds) .................... +300°C Thermal resistance, junction-to-case (Θ_JC) .................. See MIL-STD-1835 Junction temperature (T_J) ................................... +175°C Maximum power dissipation at T_A = +55°C (in still air)(P_D) .. 500 mW

Supply voltage range (V_CC) .................................. +4.5 V dc to +5.5 V dc Minimum high level input voltage (V_IH) ...................... +2.1 V Maximum low level input voltage (V_IL) ....................... +0.5 V Input voltage range (V_IN) ................................... +0.0 V dc to V_CC Output voltage range (V_OUT) ................................. +0.0 V dc to V_CC Maximum high level output current (I_OH) ..................... −8 mA Maximum low level output current (I_OL) ...................... +8 mA Maximum input rise or fall rate (Δt/ΔV) ..................... +20 ns/V Case operating temperature range (T_C) ....................... −55°C to +125°C

Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) ................ XX percent 5/

intended Use: