scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes B, Q, and M) and space application (device classes S and V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of radiation hardness assurance (RHA) levels are reflected in the PIN.

The PIN shall be shown in the following example:

Device classes M, B, and S RHA marked devices shall meet the MIL-M-38510 specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function Speed 01 80960MC-16 32-bit microprocessor with floating and MMU 16 MHz 01 80960MC-20 32-bit microprocessor with floating and MMU 20 MHz 01 80960MC-25 32-bit microprocessor with floating and MMU 25 MHz 01 80960XA-16 32-bit microprocessor with floating and MMU 16 MHz 1/ 01 80960XA-20 32-bit microprocessor with floating and MMU 20 MHz 1/ 01 80960XA-25 32-bit microprocessor with floating and MMU 25 MHz 1/

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 B or S Certification and qualification to MIL-M-38510 Q or V Certification and qualification to MIL-I-38535

For device classes M, B, and S, case outline(s) shall meet the requirements in appendix C of MIL-M-38510 and as listed below. For device classes Q and V, case outlines(s) shall meet the requirements of MIL-I-38535, appendix C of MIL-M-38510, and as listed below.

Outline letter Case outline X P-AF (12-pin, 1.480" × .345"), pin grid array package Y See figure 1 (164-terminal, 1.140" × 1.140" × .115"), leaded chip carrier which unformed leads.

The lead finish shall be as specified in MIL-M-38510 for classes M, B, and S or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Supply voltage range - - - - - - - - - - - - - - - - −65°C to +150°C Voltage on any pin with respect to ground - - - - - −0.5 V to V_CC +0.5 V Power dissipation (P_D) - - - - - - - - - - - - - - - 2.6 W Lead temperature (soldering, 10 seconds) - - - - - - +275°C Thermal resistance, junction-to-case (Θ_JC) - - - - - See MIL-STD-1835 Case Y - - - - - - - - - - - - - - - - - - - - - - 8°C/W Junction temperature (T_J)- - - - - - - - - - - - - - +150°C

intended Use: