DLA - SMD-5962-87749 REV B
MICROCIRCUIT, DIGITAL, ECL, TWO MODULUS PRESCALER, DIVIDE BY 10 AND 11, MONOLITHIC SILICON
| Organization: | DLA |
| Publication Date: | 26 March 1993 |
| Status: | inactive |
| Page Count: | 22 |
scope:
This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes B, Q, and M) and space application (device classes S and V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of radiation hardness assurance (RHA) levels are reflected in the PIN.
The PIN shall be as shown in the following example:
Device classes M, B, and S RHA marked devices shall meet the MIL-M-38510 specified RHA levels end shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
The device type(s) shall identify the circuit function as follows:
Device type Generic number Circuit function 01 12513 Two-modulus prescaler, an ECL to TTL translator, with divide by 10 and 11
The device class designator shall be a single letter identifying the product assurance level as follows:
Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 B or S Certification and qualification to MIL-M-38510 Q or V Certification and qualification to MIL-I-38515
For device classes M, B, and S, case outline(s) shall meet the requirements in appendix C of MIL-M-18510 and as listed below. For device classes Q and V, case outline(s) shall meet the requirements of MIL-I-38535, appendix C of MIL-I-38510, and as listed below.
Outline letter Case outline E D-2 (16-lead, .840" × .310" × .200"), dual-in-line package
The lead finish shall be as specified in MIL-M-38510 for classes M, B, and S or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when teed finishes A, B, and C are considered acceptable and interchangeable without preference.
Supply voltage range (VCC) (VEE = 0) - - - - - - 0 V dc to +7.0 V dc Supply voltage range (VEE) (VCC = 0) - - - - - - −8.0 V dc to 0 V dc Output voltage (VOUT) - - - - - - - - - - - - - +5.5 V dc Input voltage (VIN) - - - - - - - - - - - - - - +5.5 V dc Maximum power dissipation - - - - - - - - - - - 460 mW Storage temperature range (TS) - - - - - - - - - −65°C to 175°C Lead temperature (soldering, 10 seconds) - - - - +300°C Junction temperature (TJ) - - - - - - - - - - - +165°C Thermal resistance, junction-to-case (ΘJC) - - - See MIL-M-38510, appendix C
Supply voltage range (VCC) (VEE = 0) - - - - - - 4.5 V dc minimum to 5.5 V dc maximum Supply voltage range (VEE) (VCC = 0) - - - - - - −5.46 V dc minimum to −4.94 V dc maximum Case operating temperature range (TC) - - - - - −55°C to +125°C
Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) - - XX percent 2/
intended Use:
Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.
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