DS/IEC 326-2
EN= Printed boards - Part 2: Test methods
inactive
| Organization: | DS |
| Publication Date: | 18 August 1989 |
| Status: | inactive |
scope:
The standard contains test methods and procedures for printe d boards, irrespective of their method of manufacture, when they are ready for the mounting of the components, with the object of assessing the properties, dimensions and performan ce of printed boards. Deals with test 19f: Thermal shock, floati ng, solder bath 280 degrees C. Includes Appendix B: Outgassing t est of plated-through holes.
Document History
July 8, 1991
Printed boards - Part 2: Test methods
The standard is a catalogue of test methods. It relates to test methods and procedures for printed boards, irrespective of their method of manufacturing, when they are ready for the mounting of...
DS/IEC 326-2
August 18, 1989
EN= Printed boards - Part 2: Test methods
The standard contains test methods and procedures for printe d boards, irrespective of their method of manufacture, when they are ready for the mounting of the components, with the object of...
January 1, 1981
Printed boards - Part 2: Test Methods - First supplement
Completes the following tests: Test 3c: Change in resistance of plated-through holes, thermal cycling; Test 10c: Peel st rength, flexible printed boards, standard atmospheric condit ions: Test 14a:...
Printed boards - Part 2: Test methods with Amendment No. 1 (1986)
The standard contains test methods and procedures for printe d boards, irrespective of their method of manufacture, when they are ready for the mounting of the components, with the object of...