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IEC 60749-14

Semiconductor devices Mechanical and climatic test methods Part 14: Robustness of terminations (lead integrity)

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Organization: IEC
Publication Date: 1 August 2003
Status: active
Page Count: 36
ICS Code (Semiconductor devices in general): 31.080.01

Document History

IEC 60749-14
August 1, 2003
Semiconductor devices Mechanical and climatic test methods Part 14: Robustness of terminations (lead integrity)
A description is not available for this item.

References

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