IEC 60749-14
Semiconductor devices Mechanical and climatic test methods Part 14: Robustness of terminations (lead integrity)
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| Organization: | IEC |
| Publication Date: | 1 August 2003 |
| Status: | active |
| Page Count: | 36 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
Document History
IEC 60749-14
August 1, 2003
Semiconductor devices Mechanical and climatic test methods Part 14: Robustness of terminations (lead integrity)
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