scope:

This drawing describes device requirements for class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices".

The complete part number shall be as shown in the following example:

The device types shall identify the circuit function as follows:

Device type Generic number Circuit function 01 54FCT821A 10-bit noninverting register 02 54FCT821B 10-bit noninverting register

The case outlines shall be as designated in appendix C of MIL-M-38510, and as follows:

Outline letter Case outline K F-6 (24-lead, .640" × .420" × .090"), flat package L D-9 (24-lead, 1.280" × .310" × .200"), dual-in-line package 3 C-4 (28-terminal, .460" × .460" × .100"), square chip carrier package

Supply voltage - - - - - - - - - - - - - - - - - - - −0.5 V dc to +6.0 V dc Input voltage range- - - - - - - - - - - - - - - - - −0.5 V dc to V_CC +0.5 V dc Output voltage range - - - - - - - - - - - - - - - - −0.5 V dc to V_CC +0.5 V dc DC input diode current (I_IK) - - - - - - - - - - - - −20 mA DC output diode current (I_OK)- - - - - - - - - - - - −50 mA DC output current- - - - - - - - - - - - - - - - - - ±100mA Maximum power dissipation (P_D) 2/- - - - - - - - - - 500 mW Thermal resistance, junction-to-case (θ_JC) - - - - - See MIL-M-38510, appendix C Storage temperature range- - - - - - - - - - - - - - −65°C to +150°C Junction temperature (T_J)- - - - - - - - - - - - - - +175°C Lead temperature (soldering, 10 seconds) - - - - - - +300°C

Supply voltage range (V_CC) - - - - - - - - - - - - - +4.5 V dc to +5.5 V dc Maximum low level input voltage (V_IL)- - - - - - - - 0.8 V dc Minimum high level input voltage (V_IH) - - - - - - - 2.0 V dc Case operating temperature (T_C)- - - - - - - - - - - −55°C to +125°C

intended Use: