scope:

This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN is as shown in the following example:

Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) identify the circuit function as follows:

Device type Generic number Circuit function 01 ACS138 Radiation hardened, SOS, advanced CMOS, 3-to-8 line decoder/demultiplexer

The device class designator is a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38545, appendix A Q or V Certification and qualification to MIL-PRF-38535

The case outline(s) are as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style E CDIP2-T16 16 Dual-in-line X CDFP4-F16 16 Flat pack

The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M.

Supply voltage range (V_CC) ................................................ −0.5 V dc to +7.0 V dc DC input voltage range (V_IN) .............................................. −0.5 V dc to V_CC + 0.5 V dc DC output voltage range (V_OUT) ............................................ −0.5 V dc to V_CC + 0.5 V dc DC input current, any one input (I_IN) ..................................... ±10 mA DC output current, any one output (I_OUT) .................................. ±50 mA Storage temperature range (T_STG) .......................................... −65°C to +150°C Lead temperature (soldering, 10 seconds) .................................. +265°C Thermal resistance, junction-to-case (θ_JC): Case outline E ........................................................... 24°C/W Case outline X ........................................................... 29°C/W Thermal resistance, junction-to-ambient (θ_JA): Case outline E ........................................................... 74°C/W Case outline X ........................................................... 116°C/W Junction temperature (T_J) ................................................. +175°C Maximum package power dissipation at T_A = +125°C (P_D): 4/ Case outline E ........................................................... 0.68 W Case outline X ........................................................... 0.43 W

Supply voltage range (V_CC) ................................................ +4.5V dc to +5.5 V dc Input voltage range (V_IN) ................................................. +0.0 V dc to V_CC Output voltage range (V_OUT) ............................................... +0.0 V dc to V_CC Maximum low level input voltage (V_IL) ..................................... 30% of V_CC Minimum high level input voltage (V_IH) .................................... 70% of V_CC Case operating temperature range (T_C) ..................................... −55°C to +125°C Maximum input rise and fall time at V_CC = 4.5 V (t_r, t_f) .................. 10 ns/V Radiation features: Total dose ............................................................... > 3 × 10⁵ Rads (Si) Single event phenomenon (SEP) effective linear energy threshold (LET) no upsets (see 4.4.4.4) .................. > 100 MeV/(cm²/mg) 5/ Dose rate upset (20 ns pulse) ........................................... Not tested Latch-up ................................................................ None 5/ Dose rate survivability ................................................. Not tested

intended Use: