scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes B, Q, and H) and space application (device classes S and V) and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class H microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of Radiation Hardness Assurance (RHA) Levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device classes M, B, and S RHA marked devices shall meet the MIL-M-38510 specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V devices shall meet or exceed the electrical performance characteristics specified in table I herein after exposure to the specified irradiation levels specified in the absolute maximum ratings herein and the RHA marked device shall be marked in accordance with MIL-I-38535. A dash (-) indicates a non-RHA device.

The device types shall identify the circuit function as follows:

Device type Generic number 1/ Circuit function Access time 01 7C269 8K × 8-bit registered diagnostic PROM 60 ns 02 7C269 8K × 8-bit registered diagnostic PROM 50 ns 03 7C269 8K × 8-bit registered diagnostic PROM 25 ns 04 7C269 8K × 8-bit registered diagnostic PROM 18 ns

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 B or S Certification and qualification to NIL-M-38510 Q or V Certification and qualification to MIL-I-38535

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Out Line letter Descriptive designator Terminals Package style X CDIP3-T28 or GDIP4-T28 28 Dual-in-Line package Y GDFP2-F28 28 Flat package 3 CQCC1-N28 28 Square Leadless chip carrier package

The Lead finish shall be as specified in MIL-M-38510 for classes M, B, and S or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when Lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Supply voltage range to ground potential (V_CC) ............ −0.5 V dc to +7.0 V dc DC voltage applied to the outputs in the high Z state ..... −0.5 V dc to +7.0 V dc DC input voltage .......................................... −3.0 V dc to +7.0 V dc DC program voltage ....................................... 13.0 V dc Maximum power dissipation ................................. 1.0 W Lead temperature (soldering, 10 seconds) .................. +260°C Thermal resistance, junction-to-case (θ_JC) ................ See MIL-STD-1835 Junction temperature (T_J) ................................ +175°C Storage temperature range (T_STG) ......................... −65°C to +150°C Temperature under bias .................................... −55°C to +125°C Data retention ............................................ 10 years minimum

Supply voltage range (V_CC) .................... +4.5 V dc minimum to +5.5 V dc maximum Ground voltage (GND) .......................... 0 V dc Input high voltage (V_IH) ...................... 2.0 V dc minimum Input low voltage (V_IL) ...................... 0.8 V dc maximum Case operating temperature range (T_C) ......... −55°C to +125°C

Fault coverage measurement of manufacturing Logic tests (MIL-STD-883, test method 5012) ........ XX percent 4/

intended Use: