scope:

This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN is as shown in the following example:

Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) identify the circuit function as follows:

Device Type Generic number Circuit function 01 TSB14C01 5 V 1394-1995 Backplane Transceiver/Arbiter

The device class designator is a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535

The case outline(s) are as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style X See figure 1 68 Ceramic quad flat pack

The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M.

Supply voltage range, (V_CC) ........................................... −0.5 V dc to +6.0 V dc Input voltage range (V_IN) ............................................. −0.5 V dc to V_CC+0.5 V dc Output voltage (V_OUT)................................................... −0.5 V dc to V_CC+0.5 V dc Continuous total power dissipation at 25°C ............................. 1689 mW 3/ Operating free-air temperature range (T_A) ............................. −55°C to +125°C Storage temperature range (T_STG) ....................................... −65°C to +150°C Lead temperature 1.6 mm (1/16 inch) from case for 10 seconds ........... +300°C Thermal resistance, junction-to-case (Θ_JC).............................. 3°C/W Thermal resistance, junction-to-air (Θ_JA)............................... 74°C/W

Supply voltage (V_CC) .................................................. 4.5 V dc to 5.25 V dc High level input voltage range (V_IH) CMOS inputs ...................... +0.7 V_CC TTL input ........................ +2.0 V dc to V_CC Low level input voltage range (V_IL) CMOS inputs ....................... +0.0 V dc to +0.2 V_CC TTL input ........................ +0.0 V dc to +0.8 V Input voltage range (V_IN) CMOS/TTL .................................... +0.0 V dc to V_CC High-level output current (I_OH) CMOS Drivers .......................... +12.0 mA TTL Drivers ........................... +8.0 mA Low-level output current (I_OH) CMOS Drivers ........................... +24 mA TTL Drivers ........................... +8.0 mA Case operating temperature range (T_C) ................................. −55°C to +125°C

intended Use: