scope:
This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.
The PIN is as shown in the following example:
Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
The device type(s) identify the circuit function as follows:
Device type Generic number Circuit function
01 54ABTE16245 16-bit incident-wave switching bus
transceiver with three-state outputs,
TTL compatible inputs
The device class designator is a single letter identifying the product assurance level as follows:
Device class Device requirements documentation
M Vendor self-certification to the requirements for MIL-STD-883 compliant,
non-JAN class level B microcircuits in accordance with MIL-PRF-38535,
appendix A
Q or V Certification and qualification to MIL-PRF-38535
The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter Descriptive designator Terminals Package style
X GDFP1-F48 48 Flat pack
The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M.
Supply voltage range (VCC) .................................................... −0.5 V dc to +7.0 V dc
DC input voltage range (VIN)(except I/O ports) ................................ −0.5 V dc to +7.0 V dc 4/
DC output voltage range applied to any output in the high state or
power-off state (VOUT) ....................................................... −0.5 V dc to +5.5 V dc 4/
DC output current(IOL)(per output) ............................................ +128 mA
DC input clamp current (IIK) (VIN <0.0V) ...................................... −18 mA
DC output clamp current (IOK)(VOUT <0.0 V) .................................... −50 mA
Maximum power dissipation at TA = +55°C (in still air) (PD) ................... 827 mW 5/
Storage temperature range (TSTG) .............................................. −65°C to +150°C
Lead temperature (soldering, 10 seconds) ...................................... +300°C
Thermal resistance, junction-to-case (ΘJC) .................................... See MIL-STD-1835
Junction temperature (TJ) ..................................................... +175°C
Supply voltage range (VCC).................................................... +4.5 V dc to +5.5 V dc
Minimum high level input voltage (VIH):
[O bar][E bar]............................................................................ +2.0 V
Except [O bar][E bar]..................................................................... +1.6 V
Maximum low level input voltage (VIL):
[O bar][E bar]............................................................................ +0.8 V
Except [O bar][E bar]..................................................................... +1.4 V
Input voltage range (VIN)...................................................... +0.0 V dc to VCC
Maximum high level output current (IOH):
B bus......................................................................... −12 mA
A bus......................................................................... −24 mA
Maximum low level output current (IOL):
B bus ........................................................................ +12 mA
A bus ........................................................................ +64 mA
Maximum input transition rise or fall rate (Δt/ΔV)(outputs enabled) ........... 10 ns/V
Operating case temperature range (TC) ......................................... −55°C to +125°C
Fault coverage measurement of manufacturing
logic tests (MIL-STD-883, test method 5012) .................................. XX percent 7/
intended Use:
Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.
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Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.
Microcircuits covered by this drawing will replace the same generic device covered by a contractor-prepared specification or drawing.
Device class Q devices will replace device class M devices.
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