scope:

This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN is as shown in the following example:

Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) identify the circuit function as follows:

Device type Generic number Circuit function 01 54CBTD3384 10-bit bus-exchange switch with three- state outputs and level shifting, TTL compatible inputs

The device class designator is a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535

The case outline(s) are as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style K GDFP2-F24 or CDFP3-F24 24 Flat package L GDIP3-T24 or CDIP4-T24 24 Dual-in-line 3 CQCC1-N28 28 Square leadless chip carrier

The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M.

Supply voltage range (V_CC)....................................................... −0.5 V dc to +7.0 V dc DC input voltage range (V_IN)..................................................... −0.5 V dc to +7.0 V dc 4/ Continuous channel current....................................................... 128 mA DC input clamp current (I_IK) (V_I/O < 0.0) ........................................−50 mA Maximum power dissipation at (TA = +55°C in still air) (P_D) ..................... 772 mW 5/ Storage temperature range (T_STG) ................................................ −65°C to +150°C Lead temperature (soldering, 10 seconds) ........................................ +300°C Thermal resistance, junction-to-case (Θ_JC) ...................................... See MIL-STD-1835 Junction temperature (T_J) ....................................................... +150°C

Supply voltage range (V_CC) ...................................................... +4.5 V dc to +5.5 V dc Minimum high level control input voltage (V_IH) .................................. +2.0 V dc Maximum low level control input voltage (V_IL) ................................... +0.8 V dc Case operating temperature range (T_C) ........................................... −55°C to +125°C

Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012).................................... XX percent 6/

intended Use: