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DLA - SMD-5962-89523 REV A

MICROCIRCUIT, MEMORY, DIGITAL, CMOS, 64 X 4 PARALLEL FIFO, MONOLITHIC SILICON

inactive
Organization: DLA
Publication Date: 29 April 1994
Status: inactive
Page Count: 18
scope:

This drawing describes device requirements for class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices".

The complete PIN shall be as shown in the following example:

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function Shift in/out rate 01,05 (See 6.6) 64 × 5 CMOS parallel FIFO 10 MHz 02,06 (See 6.6) 64 × 5 CMOS parallel FIFO 15 MHz 03,07 (See 6.6) 64 × 5 CMOS parallel FIFO 25 MHz 04,08 (See 6.6) 64 × 5 CMOS parallel FIFO 35 MHz

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style E GDIP1-T16 or CDIP2-T16 16 Dual-in-line package 2 CQCC1-N20 20 Square leadless chip carrier

The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein). Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Terminal voltage with respect to ground- - - - - - - −0.5 V dc to +7.0 V dc DC output current- - - - - - - - - - - - - - - - - - 50 mA Storage temperature range- - - - - - - - - - - - - - −65°C to +150°C Maximum power dissipation (PD) 1/- - - - - - - - - - 1.0 w Lead temperature (soldering, 10 seconds) - - - - - - +260°C Thermal resistance, junction-to-case (ΘJC) - - - - - See MIL-STD-1835 Junction temperature (TJ)- - - - - - - - - - - - - - +175°C

Supply voltage (VCC) - - - - - - - - - - - - - - - - 4.5 V dc to 5.5 V dc Supply voltage (GND) - - - - - - - - - - - - - - - - 0 V dc Input high voltage (VIH) - - - - - - - - - - - - - - 2.0 V dc minimum Input low voltage (VIL)- - - - - - - - - - - - - - - 0.8 V dc maximum 2/ Case operating temperature range (TC)- - - - - - - - −55°C to +125°C

intended Use:

Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.

Document History

March 23, 2023
MICROCIRCUIT, MEMORY, DIGITAL, CMOS, 64 X 4 PARALLEL FIFO, MONOLITHIC SILICON
Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A.
May 1, 2018
MICROCIRCUIT, MEMORY, DIGITAL, CMOS, 64 X 4 PARALLEL FIFO, MONOLITHIC SILICON
Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes
November 9, 2012
MICROCIRCUIT, MEMORY, DIGITAL, CMOS, 64 X 4 PARALLEL FIFO, MONOLITHIC SILICON
Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.
January 27, 2006
MICROCIRCUIT, MEMORY, DIGITAL, CMOS, 64 X 4 PARALLEL FIFO, MONOLITHIC SILICON
Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.
July 5, 1994
MICROCIRCUIT, MEMORY, DIGITAL, CMOS, 64 X 4 PARALLEL FIFO, MONOLITHIC SILICON
A description is not available for this item.
SMD-5962-89523 REV A
April 29, 1994
MICROCIRCUIT, MEMORY, DIGITAL, CMOS, 64 X 4 PARALLEL FIFO, MONOLITHIC SILICON
This drawing describes device requirements for class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices"....
August 23, 1989
MICROCIRCUIT, MEMORY, DIGITAL, CMOS, 64 X 4 PARALLEL FIFO, MONOLITHIC SILICON
This drawing describes device requirements for class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices"....
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