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DLA - SMD-5962-86825 REV A

MICROCIRCUIT, DIGITAL, HIGH SPEED CMOS, QUAD D-TYPE FLIP-FLOP WITH THREE-STATE OUTPUTS, MONOLITHIC SILICON

inactive
Organization: DLA
Publication Date: 10 February 1987
Status: inactive
Page Count: 14
scope:

This drawing describes device requirements for class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices".

The complete part number shall be as shown in the following example:

The device type shall identify the circuit function as follows:

Device type Generic number Circuit function 01 54RC173 Flip-flop, quad D, 3-state

The case outlines shall be as designated in appendix C of MIL-H-38510, and as follows:

Outline letter Case outline E D-2 (16-lead, ¼" × ⅞"), dual-in-line package 2 C-2 (20-terminal, .350" × .350"), square chip carrier package

Supply voltage range - - - - - - - - - - - - - - - - - −0.5 V dc to +7.0 V dc DC input voltage - - - - - - - - - - - - - - - - - - - −0.5 V dc to VCC + 0.5 V dc DC output voltage - - - - - - - - - - - - - - - - - - −0.5 V dc to VCC + 0.5 V dc Clamp diode current - - - - - - - - - - - - - - - - - ±20 mA DC output current (per pin) - - - - - - - - - - - - - ±35 mA DC VCC or GND current (per pin) - - - - - - - - - - - ±70 mA Storage temperature range - - - - - - - - - - - - - - −65°C to +150°C Maximum power dissipation (PD) 2/ - - - - - - - - - - 500 mW Lead temperature (soldering, 10 seconds) - - - - - - - +260°C Thermal resistance, junction-to-case (θJC): Case E- - - - - - - - - - - - - - - - - - - - - - - See MIL-M-38510, appendix C Case 2- - - - - - - - - - - - - - - - - - - - - - - +60°C/W 3/ Junction temperature (TJ)- - - - - - - - - - - - - - - +175°C

Supply voltage (VCC) - - - - - - - - - - - - - - - - - +2.0 V dc to +6.0 V dc Case operating temperature range (TC)- - - - - - - - - −55°C to +125°C Input rise or fall time: VCC = 2.0 V - - - - - - - - - - - - - - - - - - - 0 to 1000 ns VCC = 4.5 V - - - - - - - - - - - - - - - - - - - 0 to 500 ns VCC = 6.0 V - - - - - - - - - - - - - - - - - - - 0 to 400 ns

Minimum setup time, input D or DE to clock (tS): TC = +25°C: VCC = 2.0 V - - - - - - - - - - - - - - - - - - - 100 ns VCC = 4.5 V - - - - - - - - - - - - - - - - - - - 20 ns VCC = 6.0 V - - - - - - - - - - - - - - - - - - - 17 ns TC = −55°C to +125°C: VCC = 2.0 V - - - - - - - - - - - - - - - - - - - 150 ns VCC = 4.5 V - - - - - - - - - - - - - - - - - - - 30 ns VCC = 6.0 V - - - - - - - - - - - - - - - - - - - 26 ns Minimum clock pulse width (tW): TC = +25°C: VCC = 2.0 V - - - - - - - - - - - - - - - - - - - 90 ns VCC = 4.5 V - - - - - - - - - - - - - - - - - - - 18 ns VCC = 6.0 V - - - - - - - - - - - - - - - - - - - 15 ns TC = −55°C to +125°C: VCC = 2.0 V - - - - - - - - - - - - - - - - - - - 135 ns VCC = 4.5 V - - - - - - - - - - - - - - - - - - - 27 ns VCC = 6.0 V - - - - - - - - - - - - - - - - - - - 23 ns Minimum hold time, clock to input D or DE (tH). TC = +25°C: VCC = 2.0 V - - - - - - - - - - - - - - - - - - - 25 ns VCC = 4.5 V - - - - - - - - - - - - - - - - - - - 5 ns VCC = 6.0 V - - - - - - - - - - - - - - - - - - - 5 ns TC = −55°C to +125°C: VCC = 2.0 V - - - - - - - - - - - - - - - - - - - 40 ns VCC = 4.5 V - - - - - - - - - - - - - - - - - - - 8 ns VCC = 6.0 V - - - - - - - - - - - - - - - - - - - 7 ns Maximum frequency (fmax) TC = +25°C: VCC = 2.0 V - - - - - - - - - - - - - - - - - - - 5 MHz VCC = 4.5 V - - - - - - - - - - - - - - - - - - - 27 MHz VCC = 6.0 V - - - - - - - - - - - - - - - - - - - 32 MHz TC = −55°C to +125°C: VCC = 2.0 V - - - - - - - - - - - - - - - - - - - 3.6 MHz VCC = 4.5 V - - - - - - - - - - - - - - - - - - - 18 MHz VCC = 6.0 V - - - - - - - - - - - - - - - - - - - 21 MHz Minimum reset pulse width (tW): TC = +25°C: VCC = 2.0 V - - - - - - - - - - - - - - - - - - - 100 ns VCC = 4.5 V - - - - - - - - - - - - - - - - - - - 20 ns VCC = 6.0 V - - - - - - - - - - - - - - - - - - - 17 ns TC = −55°C to +125°C: VCC = 2.0 V - - - - - - - - - - - - - - - - - - - 150 ns VCC = 4.5 V - - - - - - - - - - - - - - - - - - - 30 ns VCC = 6.0 V - - - - - - - - - - - - - - - - - - - 26 ns Minimum recovery time reset inactive to clock (tREC): TC = +25°C: VCC = 2.0 V - - - - - - - - - - - - - - - - - - - 90 ns VCC = 4.5 V - - - - - - - - - - - - - - - - - - - 18 ns VCC = 6.0 V - - - - - - - - - - - - - - - - - - - 15 ns TC = −55°C to +125°C: VCC = 2.0 V - - - - - - - - - - - - - - - - - - - 135 ns VCC = 4.5 V - - - - - - - - - - - - - - - - - - - 27 ns VCC = 6.0 V - - - - - - - - - - - - - - - - - - - 23 ns

intended Use:

Microcircuits conforming to this drawing are intended for use when military specifications do not exist and qualified military devices that will perform the required function are not available for... View More

Document History

SMD-5962-86825 REV E
April 15, 2021
MICROCIRCUIT, DIGITAL, HIGH SPEED CMOS, QUAD D-TYPE FLIP-FLOP WITH THREE-STATE OUTPUTS, MONOLITHIC SILICON
Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A.
SMD 5962-86825
December 22, 2014
MICROCIRCUIT, DIGITAL, HIGH SPEED CMOS, QUAD D-TYPE FLIP-FLOP WITH THREE-STATE OUTPUTS, MONOLITHIC SILICON
Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.
SMD 5962-86825
October 20, 2008
MICROCIRCUIT, DIGITAL, HIGH SPEED CMOS, QUAD D-TYPE FLIP-FLOP WITH THREE-STATE OUTPUTS, MONOLITHIC SILICON
Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.
SMD-5962-86825 REV B
May 15, 2003
MICROCIRCUIT, DIGITAL, HIGH SPEED CMOS, QUAD D-TYPE FLIP-FLOP WITH THREE-STATE OUTPUTS, MONOLITHIC SILICON
A description is not available for this item.
SMD-5962-86825 REV A
February 10, 1987
MICROCIRCUIT, DIGITAL, HIGH SPEED CMOS, QUAD D-TYPE FLIP-FLOP WITH THREE-STATE OUTPUTS, MONOLITHIC SILICON
This drawing describes device requirements for class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices"....
SMD-5962-86825
September 16, 1986
MICROCIRCUIT, DIGITAL, HIGH SPEED CMOS, QUAD D-TYPE FLIP-FLOP WITH THREE-STATE OUTPUTS, MONOLITHIC SILICON
A description is not available for this item.
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References

This document references:
MIL-STD-1835 - Electronic Component Case Outlines
Published by NPFC on September 21, 2009
This standard establishes and maintains a compilation of electronic component case outlines and should be useful to all levels of manufacturing that culminate in the production of reliable and...
This document references:
MIL-HDBK-103 - LIST OF STANDARD MICROCIRCUIT DRAWINGS
Published by NPFC on March 8, 2021
Purpose. The Standard Microcircuit Drawing Program (SMDP) is directly under the auspices of the DoD Parts Management Program (PMP). The PMP is implemented by MIL-HDBK-512, "Parts Management." The PMP...
This document references:
MIL-HDBK-780D VALID NOTICE 1 - Standard Microcircuit Drawings
Published by DLA on December 28, 2021
A description is not available for this item.
This document references:
MIL-PRF-38535M - INTEGRATED CIRCUITS (MICROCIRCUITS) MANUFACTURING, GENERAL SPECIFICATION FOR
Published by DLA on November 1, 2022
Scope. This specification establishes the general performance requirements for integrated circuits or microcircuits and the quality and reliability assurance requirements, which are to be met for...
This document references:
MIL-STD-883 - TEST METHOD STANDARD MICROCIRCUITS
Published by NPFC on September 16, 2019
Purpose. This standard establishes uniform methods, controls, and procedures for testing microelectronic devices suitable for use within Military and Aerospace electronic systems including basic...
View Less
View All
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