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ISO 2626

Copper - Hydrogen Embrittlement Test

active, Most Current
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Organization: ISO
Publication Date: 1 January 1973
Status: active
Page Count: 4
ICS Code (Other methods of testing of metals): 77.040.99

Document History

ISO 2626
January 1, 1973
Copper - Hydrogen Embrittlement Test
A description is not available for this item.

References

This document is referenced by:
EN 1976 - Copper and copper alloys - Cast unwrought copper products
Published by CEN on October 1, 2012
This European Standard specifies the composition and physical properties of cast unwrought copper products (refinery shapes) in thirteen grades of copper and nine silver-bearing copper grades. The...
This document is referenced by:
EN 1977 - Copper and copper alloys - Copper drawing stock (wire rod)
Published by CEN on January 1, 2013
This European Standard specifies the composition, mechanical, electrical and physical properties for high conductivity copper drawing stock (wire rod) suitable for fabrication into wire by cold...
This document is referenced by:
SN EN 1977 - Copper and copper alloys - Copper drawing stock (wire rod)
Published by SNV on April 1, 2013
This European Standard specifies the composition, mechanical, electrical and physical properties for high conductivity copper drawing stock (wire rod) suitable for fabrication into wire by cold...
This document is referenced by:
ISO 7539-11 - Corrosion of metals and alloys - Stress corrosion cracking - Part 11: Guidelines for testing the resistance of metals and alloys to hydrogen embrittlement and hydrogenassisted cracking
Published by ISO on April 15, 2013
This part of ISO 7539 gives guidance on the key features that should be accounted for in designing and conducting tests to evaluate the resistance of a metal or its alloy to hydrogen embrittlement...
This document is referenced by:
EN 13604 - Copper and copper alloys - Semiconductor devices, electronic and vacuum products made from high conductivity copper
Published by CEN on June 1, 2013
This European Standard specifies the composition, property requirements including electrical properties and tolerances on dimensions and form of semiconductor devices, electronic and vacuum products...
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