scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes B, Q, and M) and space application (device classes S and V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M Microcircuits represent non-JAN class B Microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN deices". When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device classes M, B, and S RHA marked devices shall meet the MIL-M-38510 specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function 01 54HC51 2-wide, 2-input and 2-wide, 3-input and-or-invert gates

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 B or S Certification and qualification to MIL-M-38510 Q or V Certification and qualification to MIL-I-38535

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style C GDIPI-T14 or CDIP2-T14 14 Dual-in-line 2 CQCC1-N20 20 Square leadless chip carrier

The lead finish shall be as specified in MIL-M-38510 for classes M, B, and S or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Supply voltage range (V_CC) - - - - - - - - - - - - - - - - - - - - - - −0.5 V dc to +7.0 V dc DC input diode current (I_IK) (V_I < 0 V, V_I > V_CC) - - - - - - - - - - ±20 mA DC output diode current (I_OK) (V_O < 0 V, V_O > V_CC) - - - - - - - - - - ±20 mA DC drain current, per output (I_O) (0 V ≤ V_O ≤ V_CC) - - - - - - - - - ±25 mA DC V_CC or ground current (I_CC or I_GND) (per pin) - - - - - - - - - - - ±50 mA Maximum power dissipation (P_D) - - - - - - - - - - - - - - - - - - - - 500 mW 4/ Storage temperature range (T_STG) - - - - - - - - - - - - - - - - - - - −65°C to +150°C Lead temperature (soldering, 10 seconds) - - - - - - - - - - - - - - - +300°C Thermal resistance, junction-to-case (θ_JC) - - - - - - - - - - - - - - See MIL-STD-1835 Junction temperature (T_J) - - - - - - - - - - - - - - - - - - - - - - +175°C

Supply voltage range (V_CC) - - - - - - - - - - - - - - - - - - - - - - 2.0 V dc to 6.0 V dc Input voltage range - - - - - - - - - - - - - - - - - - - - - - - - - 0.0 V dc to V_CC Output voltage range - - - - - - - - - - - - - - - - - - - - - - - - - 0.0 V dc to V_CC Case operating temperature (T_C) - - - - - - - - - - - - - - - - - - - −55°C to +125°C Maximum low level input voltage (V_IL): V_CC = 2.0 V - - - - - - - - - - - - - - - - - - - - - - - - - - - - 0.3 V dc V_CC = 4.5 V - - - - - - - - - - - - - - - - - - - - - - - - - - - - 0.9 V dc V_CC = 6.0 V - - - - - - - - - - - - - - - - - - - - - - - - - - - - 1.2 V dc Minimum high level input voltage (V_IH): V_CC = 2.0 V - - - - - - - - - - - - - - - - - - - - - - - - - - - - 1.5 V dc V_CC = 4.5 V - - - - - - - - - - - - - - - - - - - - - - - - - - - - 3.15 V dc V_CC = 6.0 V - - - - - - - - - - - - - - - - - - - - - - - - - - - - 4.2 V dc Input rise and fall times (t_r, t_f): V_CC = 2.0 V - - - - - - - - - - - - - - - - - - - - - - - - - - - - 1000 ns V_CC = 4.5 V - - - - - - - - - - - - - - - - - - - - - - - - - - - - 500 ns V_CC = 6.0 V - - - - - - - - - - - - - - - - - - - - - - - - - - - - 400 ns Maximum high level output current (I_OH) - - - - - - - - - - - - - - - −5.2 mA at V_CC = 6.0 V Maximum low level output current (I_OL) - - - - - - - - - - - - - - - - +5.2 mA at V_CC = 6.0 V

Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) - - - - - - - - - - - - - XX percent 5/

intended Use:

Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.