scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). This drawing describes device requirements for hybrid microcircuits to be processed in accordance with MIL-H-38554. Two product assurance classes, military high reliability (device class H) and space application (device class K) and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of radiation hardness assurance levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device classes H and K RHA marked devices shall meet the MIL-H-38534 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

This device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation H or K Certification and qualification to MIL-H-38534

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style U See figure 1 68 Flat pack X See figure 1 66 Dual-in-line Y See figure 1 66 Flat pack Z See figure 1 69 Grid array

The lead finish shall be as specified in MIL-H-38534 for classes H and K. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Supply voltage range (V_CC) . . . . . . . . . . . . . . . −0.3 V dc to +7 V dc Storage temperature range . . . . . . . . . . . . . . . . −65°C to +150°C Thermal rise, case-to-junction . . . . . . . . . . . . . +15°C/W Lead soldering temperature (10 seconds) . . . . . . . . . +300°C Power dissipation (P_D): Device types 01 and 02, (T_C = +125°C) . . . . . . . . . 1.3 W Device types 03, 04, 05, and 06: Hottest die (100% duty cycle) . . . . . . . . . . . . 0.500 W Total hybrid (standby) . . . . . . . . . . . . . . . 0.550 W Total hybrid (100% duty cycle) . . . . . . . . . . . 1.05 W Thermal resistance, junction-to-case (θ_JC) . . . . . . . 4°C/W

Supply voltage range (V_CC): Device types 01 and 02 . . . . . . . . . . . . . . . . +4.75 V dc to +5.50 V dc Device types 03, 04, 05, and 06 . . . . . . . . . . . . +4.50 V dc to +5.50 V dc Minimum logic high input voltage (V_IH) . . . . . . . . . +2 V dc Maximum logic low input voltage (V_IL) . . . . . . . . . . +0.8 V dc Case operating temperature range (T_C) . . . . . . . . . . −55°C to +125°C

intended Use:

Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.