scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes Q and M) and space application (device class V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device class M RHA marked devices shall meet the MIL-I-38535 appendix A specified RHA Levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function 01 780 2.5/3.0 V high precision reference

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 Q or V Certification and qualification to MIL-I-38535

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style P GDIP1-T8 or CDIP2-T8 8 Dual-in-line

The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein) for class M or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Input voltage to ground (V_IN) . . . . . . . . . . . . +36 V Trim pin to ground . . . . . . . . . . . . . . . . . +36 V Temp pin to ground . . . . . . . . . . . . . . . . . +36 V Storage temperature range . . . . . . . . . . . . . . −65°C to +150°C Lead temperature (soldering, 10 seconds) . . . . . . +300°C Thermal resistance, junction-to-case (θ_JC) . . . . . 28°C/W Thermal resistance, junction-to-ambient (θ_JA) . . . . 110°C/W Power dissipation (P_D) . . . . . . . . . . . . . . . 500 mW

Operating voltage range (2.5 V output) . . . . . . . . . . . . 4.0 V to 36 V Operating voltage range (3.0 V output) . . . . . . . . . . . . 4.5 V to 36 V Ambient operating temperature range (T_A) . . . . . . . . . . . −55°C to +125°C

intended Use: