scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes Q and M) and space application (device class V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device class M RHA marked devices shall meet the MIL-I-38535 appendix A specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function 01 HS-565ARH Radiation hardened, dielectrically isolated, high speed, 12-bit, digital-to-analog converter, with current output

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 Q or V Certification and qualification to MIL-I-38535

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style J CDIP2-T24 24 Dual-in-line X CDFP4-F24 24 Flat pack

The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein) for class M or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

V_CC to power ground . . . . . . . . . . . . . . . . . . . 0 V to +18 V V_EE to power ground . . . . . . . . . . . . . . . . . . . 0 V to −18 V Voltage on DAC output (pin 9) . . . . . . . . . . . . . . −3 V to +12 V Digital input (pins 13 - 24) to power ground . . . . . . −1 V to +7 V REF IN to REF GND . . . . . . . . . . . . . . . . . . . . ±12 V Bipolar offset to REF GND . . . . . . . . . . . . . . . . ±12 V 10 V SPAN R to REF GND . . . . . . . . . . . . . . . . . ±12 V 20 V SPAN R to REF GND . . . . . . . . . . . . . . . . . ±24 V Maximum package power dissipation (T_A = +125°C)2/: case outline J . . . . . . . . . . . . . . . . . . . . 0.83 W case outline X . . . . . . . . . . . . . . . . . . . . 0.62 W Junction temperature (T_J) . . . . . . . . . . . . . . . . +175°C Storage temperature range . . . . . . . . . . . . . . . . −65°C to +150°C Lead temperature (soldering, 10 seconds) . . . . . . . . +300°C Thermal resistance, junction-to-case (Θ_JC): case outline J . . . . . . . . . . .. . . . . . . . . . 17°C/W case outline X . . . . . . . . . . . . . . . . . . .. . 15°C/W Thermal resistance, junction-to-ambient (Θ_JA): case outline J . . . . . . . . . . . . . . . . . . . . 60°C/W case outline X . . . . . . . . . . . . . . . . . . . . 80°C/W

Positive supply voltage range (V_CC). . . . . . . . . . . +11.4 V to +16.5 V Negative supply voltage range (V_EE) . . . . . . . .. . . −11.4 V to −16.5 V Digital input low voltage range . . . . . . . . . . . . 0 V to +0.8 V Digital input high voltage range . . . . . . . . . . . . +2.0 V to +5.5 V Ambient operating temperature range (T_A) . . . . . . . . −55°C to +125°C Radiation features: Neutron . . . . . . . . . . . . . . . . . . . . . . 3/ Total dose . . . . . . . . . . . . . . . . . . . . . > 100 Krads (Si) Latch up . . . . . . . . . . . . . . . . . . . . . . None 4/

intended Use: