scope:

This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN is as shown in the following example:

Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) identify the circuit function as follows:

Device type Generic number Circuit function 01 54ABT162601 18-Bit Universal Bus Transceiver with three-state outputs and B-port equivalent 25 Ohm output series resistors.

The device class designator is a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535

The case outline(s) are as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style X GDFP1-F56 56 Flat pack

The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M.

Supply voltage range (V_CC)............................................ −0.5 V dc to +7.0 V dc DC input voltage range (V_IN),(except I/O ports)....................... −0.5 V dc to +7.0 V dc 4/ DC output voltage range in the high or power-off state (V_OUT)......... −0.5 V dc to 5.5 V dc 4/ Current into any output in the low state (I_OL): A port............................................................... 96 mA B port............................................................... 30 mA DC input clamp current (I_IK)(V_IN ⩽ 0.0)............................... −18 mA DC output clamp current (I_OK)(V_OUT ⩽ 0.0)............................. −50 mA Maximum power dissipation at T_A = +55°C (in still air) (P_D)........... 673 mW 5/ Storage temperature range (T_STG)...................................... −65°C to +150°C Lead temperature (soldering, 10 seconds).............................. +300°C Thermal resistance, junction-to-case (θ_JC)............................ See MIL-STD-1835 Junction temperature (T_J)............................................. +150°C

Supply voltage range (V_CC)............................................ +4.5 V dc to +5.5 V dc Input voltage range (V_IN)............................................. 0.0 V dc to V_CC Minimum High level input voltage (V_IH)................................ +2.0 V Maximum Low level input voltage (V_IL)................................. +0.8V Maximum High level output current (I_OH): A port............................................................... −24 mA B port................................................................−12 mA Maximum Low level output current (I_OL): A port............................................................... +48 mA B port............................................................... +12 mA Maximum input transition rise or fall rate (Δt/ΔV)(outputs enabled)... 10 ns/V Minimum power-up ramp rate (Δt/ΔV_CC).................................. 200 μs/V Operating free-air temperature (T_A)................................... −55°C to +125°C

intended Use: