scope:

This drawing forms a pert of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes B, Q, and M) and space application (device classes S and V) and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of radiation hardness assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device classes m, B, and S RHA marked devices shall meet the MIL-M-38510 specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator.A dash (-) indicates a non-RHA device.

The device types shall identify the circuit function as follows:

Device type Generic number Circuit function Access time 01 7B164 16K × 4 SRAM 15 ns 02 7B164 16K × 4 SRAM 12 ns 03 7B164 16K × 4 SRAM 10 ns 04 7B166 16K × 4 SRAM with [O bar][E bar] 15 ns 05 7B166 16K × 4 SRAM with [O bar][E bar] 12 ns 06 7B166 16K × 4 SRAM with [O bar][E bar] 10 ns

The device class designator shall be a single letter identifying the product assurance level (see 6.6 herein) as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 B or S Certification and qualification to MIL-M-38510 Q or V Certification and qualification to MIL-I-38535

The case outlines shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style L GDIP3-T24 or CDIP4-T24 24 dual-in-line K GDFP2-F24 or CDFP3-F24 24 flat pack X CQCC4-N28 28 rectangular leadless chip carrier Y See figure 1 22 dual-in-line Z See figure 1 22 rectangular leadless chip carrier

The lead finish shall be as specified in MIL-M-38510 for classes M, B, and S or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Supply voltage range to ground potential (V_CC) - - - - - −0.5 V dc to +7.0 V dc DC output current - - - - - - - - - - - -- - - - - - - - 20 mA Maximum power dissipation - - - - - - - - - - - - - - - 0.800 w Lead temperature (soldering, 10 seconds) - - - - - - - - +260°C Thermal resistance, junction-to-case (θ_JC): Cases L, K, and X - - - - - - - - - - - - - - - - - - See MIL-STD-1835 Cases Y and Z - - - -- - - - - - - - - - - - - - - - 11°C/W 2/ Junction temperature (T_j) - - - - - - - - - - - - - - - +175°C Storage temperature range (T_STG) - - - - - - - - - - - - −65°C to 150°C Temperature under bias - - - - - - - - - - - - - - - - - −55°C to +125°C

Supply voltage (V_CC) - - - - - - - - - - - - - - - - - - - - +4.5 V dc minimum to +5.5 V dc maximum Ground voltage (GND) - - - - - - - - - - - - - - - - - - 0 V dc Input high voltage (V_IH) - - - - - - - - - - - - - - - - 2.2 V dc to V_CC V dc Input low voltage (V_IL) - - - - - - - - - - - - - - - - - - −0.5 V dc to 0.8 V dc 3/ Case operating temperature range (T_C) - - - - - - - −55°C to +125°C

Fault coverage measurement of manufacturing Logic tests (MIL-STD-883, test method 5012)- - - - - - - - - 4/ percent

intended Use: