CENELEC - EN 60249-2-19
Base Materials for Printed Circuits Part 2: Specifications Specification No. 19: Thin Bismaleimide/Triazine Modified Epoxide Woven Glass Fabric Copper-Clad Laminated Sheet of Defined Flammability for Use in the Fabrication of Multilayer Printed Boards
inactive, Most Current
| Organization: | CENELEC |
| Publication Date: | 1 July 1993 |
| Status: | inactive |
| Page Count: | 21 |
| ICS Code (Printed circuits and boards): | 31.180 |
Document History
EN 60249-2-19
July 1, 1993
Base Materials for Printed Circuits Part 2: Specifications Specification No. 19: Thin Bismaleimide/Triazine Modified Epoxide Woven Glass Fabric Copper-Clad Laminated Sheet of Defined Flammability for Use in the Fabrication of Multilayer Printed Boards
A description is not available for this item.
January 1, 1993
Base Materials for Printed Circuits Part 2: Specifications Specification No. 19: Thin Bismaleimide/ Triazine Modified Epoxide Woven Glass Fabric Copper-Clad Laminated Sheet of Defined Flammability for Use in the Fabrication of Multilayer Printed Boards (IEC 249-2-19: 1992/A1:1993) (Includes AMD 1)
A description is not available for this item.