scope:

This drawing describes device requirements for class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices".

The complete PIN shall be as shown in the following example:

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function Access time 01 57C43C-70 4K × 8-bit UVEPROM 70 ns 02 57C43C-55 4K × 8-bit UVEPROM 55 ns 03 57C43C-45 4K × 8-bit UVEPROM 45 ns 04 57C43C-35 4K × 8-bit UVEPROM 35 ns

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style J GDIP1-T24 or CDIP2-T24 24 Dual-in-line 1/ K GDFP2-F24 or CDFP3-F24 24 Flat pack 1/ L GDIP3-T24 or CDIP4-T24 24 Dual-in-line 1/ 3 CQCC1-N28 28 Square leadless chip carrier 1/

Voltage range on any pin with respect to ground . . . . . −0.6 V dc to +7.0 V dc V_pp range with respect to ground . . . . . . . . . . . . −0.6 V dc to +14.0 V dc Storage temperature range . . . . . . . . . . . . . . . . −65°C to +150°C Maximum power dissipation (P_D) . . . . . . . . . . . . . 1 W Lead temperature (soldering, 10 seconds) . . . . . . . . +300°C Thermal resistance, junction-to-case (θ_JC) . . . . . . . See MIL-STD-1835 Junction temperature (T_J) 2/ . . . . . . . . . . . . . . +150°C Temperature (under bias) range . . . . . . . . . . . . . −55°C to +125°C

Supply voltage range (V_CC) . . . . . . . . . . . . . . . +4.5 V dc to +5.5 V dc Ground voltage (GND) . . . . . . . . . . . . . . . . . . 0 V dc Input high voltage (V_IH) . . . . . . . . . . . . . . . . 2.0 V dc minimum Input low voltage (V_IL) . . . . . . . . . . . . . . . . . 0.8 V dc maximum Case operating temperature range (T_C) . . . . . . . . . . −55°C to +125°C

intended Use: