scope:

This drawing describes device requirements for class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices".

The complete PIN shall be as shown in the following example:

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function 01 54F381 4-bit arithmetic logic unit 02 54F181 4-bit arithmetic logic unit

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style J GDXP1-T24 or CDIP2-T24 24 Dual-in-line package R GDXP1-T20 or CDIP2-T20 20 Dual-in-line package S GDFP2-F20 or CDFP3-F20 20 Flat package 2 CQCC1-N20 20 Square leadless chip carrier 3 CQCCl-N28 28 Square leadless chip carrier

The lead finish shall be as specified in MIL-M-38510. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Supply voltage range . . . . . . . . . . . . . . . . −0.5 V dc to +7.0 V dc Input voltage range . . . . . . . . . . . . . . . . . −1.5 V dc at −18 mA to +7.0 V dc Storage temperature . . . . . . . . . . . . . . . . . −65°C to +150°C Maximum power dissipation (P_D) per device 1/ . . . . 490 mW Lead temperature (soldering, 10 seconds) . . . . . . +300°C Thermal resistance, junction-to-case (Θ_JC) . . . . . See MIL-STD-1835 Junction temperature (T_J) . . . . . . . . . . . . . . +175°C

Supply voltage range (V_CC) . . . . . . . . . . . . . +4.5 V dc minimum to +5.5 V dc maximum Minimum high level input voltage (V_IH ) . . . . . . . +2.0 V dc Maximum low level input voltage (V_IL) . . . . . . . . +0.8 V dc Case operating temperature range (T_C) . . . . . . . . −55°C to +125°C

intended Use: