This document provides guidelines for the use of Chip-on-Board Technology (hereafter this term may be referenced by the acronym COB). These guidelines include: Design guidelines, Manufacturing...
This specification covers the qualification and performance requirements of multilayer circuits used in hybrid packaging. These circuits consist of three or more layers of conductor patterns...
This document provides guidelines and supporting information for manufacturing electronic assemblies. The intent is to explain the ‘‘how-to'' and ‘‘why'' information, and fundamentals for these...
Purpose of the IPC Electronic Packaging Handbook The purpose of this Electronic Packaging Handbook is to provide the appropriate insight and flows into the multifaceted topic of electronic packaging....
This document provides guidelines for surface mounting electronic parts, and for intermixing surface and through-the-board mounting techniques. In addition, it describes the types of materials and...
