scope:

This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN is as shown in the following example:

Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) identify the circuit function as follows:

Device type Generic number Circuit function 01 54LVC652A Octal Bus transceiver and register with 3-state outputs

The device class designator is a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535

The case outline(s) are as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style L GDIP3-T24 or CDIP4-T24 24 Dual-in-line K GDFP2-F24 or CDFP3-F24 24 Flat pack 3 CQCC1-N28 28 Square leadless chip carrier

The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M.

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Supply voltage range (V_CC)........................................... −0.5 V dc to +6.5 V dc DC input voltage range (V_IN): Except I/O ports.................................................... −0.5 V dc to +6.5 V dc 4/ I/O ports).......................................................... −0.5 V dc to V_CC +0.5 V dc 4/ 5/ DC output voltage range (V_OUT) (high impedance or power-off state).. −0.5 V dc to +6.5 V dc 4/ DC output voltage range (V_OUT) (high or low state)................... −0.5 V dc to V_CC +0.5 V dc 4/ 5/ DC input clamp current (I_IK) (V_IN < 0.0 V) .......................... −50 mA DC output clamp current (I_OUT) (V_OUT < 0.0 V or V_OUT > V_CC).......... ±50 mA Continuous output current (I_OUT) (V_OUT = 0.0 to V_CC)................. ±50 mA 5/ Continuous current through V_CC or GND................................ ±100 mA Maximum power dissipation at T_A = +55°C (in still air)............... 0.5 W 6/ Storage temperature range (T_STG)..................................... −65°C to + 150°C Lead temperature (soldering, 10 seconds)............................. +300°C Thermal resistance, junction-to-case (Θ_JC)........................... See MIL-STD-1835 Junction temperature (T_J)............................................ +150°C

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Supply voltage range (V_CC) (Operating)............................... +2.0 V dc to +3.6 V dc Supply voltage minimum (V_CC) (Data retention only)................... +1.5 V dc Minimum high level input voltage (V_IH) (V_CC = 2.7 V to 3.6 V)........ +2.0 V Maximum low level input voltage (V_IL) (V_CC = 2.7 V to 3.6 V)......... +0.8 V Input voltage range (V_IN)............................................ 0.0 V to +5.5 V dc Output voltage range (V_OUT): High or low state................................................... 0.0 V to V_CC High impedance state................................................ 0.0 V to 5.5 V dc Maximum high level output current (I_OH): V_CC = 2.7V.......................................................... −12 mA V_CC = 3.0 V......................................................... −24 mA Maximum low level output current (I_OL): V_CC = 2.7V.......................................................... +12 mA V_CC = 3.0 V......................................................... +24 mA Maximum input rise and fall rate (Δt/ΔV)............................. 5 ns/V Case operating temperature range (T_C)................................ −55°C to +125°C

Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012)........................ XX percent 8/

intended Use: