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NPFC - MIL-M-38510/130

MICROCIRCUITS, MONOLITHIC SILICON, BIPOLAR, INTERFACE, MEMORY CORE DRIVERS

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Organization: NPFC
Publication Date: 2 January 1986
Status: inactive
Page Count: 42
scope:

This specification covers the detail requirements for monolithic silicon bipolar interface memory core drivers. Two product assurance classes and a choice of case outline/lead finish are reflected in the complete part number.

The part number shall be in accordance with MIL-M-38510.

The device type shall be as follows:

Device type Circuit 01 Dual source and dual sink (positive-OR) 02 Quad sink (positive-OR) 03 Quad source/sink (positive-OR)

The device class shall be the product assurance level as defined in MIL-M-38510.

The case outline shall be designated as follows:

Letter Case outline, MIL-M-38510, Appendix C E D-2 (16-lead, ¼" × ⅞" dual-in-line package)

Supply voltage (VCC1) - - - - - - - - - - - - 7.0 V Supply voltage (VCC2) (device types 01, 03) - 25 V Input voltage (VIN) - - - - - - - - - - - - - 5.5 V Output collector voltage (VOCV) Device types 02, 03 - - - - - - - - - - - - 25 V Output clamp voltage (VOC) (device type 02) - 25 V Output collector current (IOC) - - - - - - - 750 mA Duty cycle for each output transistor - - - - 20% 1/ Continuous total dissipation at 25°C ambient - - - - - - - - - - - - - - - - 1375 mW Storage temperature range - - - - - - - - - - −65°C to +150°C Junction temperature (TJ) - - - - - - - - - - 150°C Lead temperature 1/16 inch from case, 60 seconds - - - - - - - - - - - - - - - - 300°C

Beneficial comments (recommendations, additions, deletions) and any pertinent data which may be of use in improving this document should be addressed to: Rome Air Development Center, (RBE-2), Griffiss AFB, NY 13441, by using the self-addressed Standardization Document Improvement Proposal (DD Form 1426) appearing at the end of this document or by letter.

Supply voltage range - - - - - - - - - - - - - 4.5 V to 5.5 V Ambient operating temperature range - - - - - - −55°C to +125°C

Maximum allowable Maximum Maxium Package Case outline power dissipation 2/ θJC θJA 16-lead dual-in-line package E 275 mW @ TA = 125°C 29°C/W 91°C/W

intended Use:

Microcircuits conforming to this specification are intended for original equipment design applications and logistic support of existing equipment.

Document History

September 29, 2023
Microcircuits, Monolithic Silicon, Bipolar, Interface, Memory Core Drivers
A description is not available for this item.
October 26, 2018
Microcircuits, Monolithic Silicon, Bipolar, Interface, Memory Core Drivers
A description is not available for this item.
January 17, 2014
Microcircuits, Monolithic Silicon, Bipolar, Interface, Memory Core Drivers
A description is not available for this item.
April 2, 2009
Microcircuits, Monolithic Silicon, Bipolar, Interface, Memory Core Drivers
This specification covers the detail requirements for monolithic silicon, bipolar, interface, memory core drivers. Two product assurance classes and a choice of case outlines and lead finishes are...
June 2, 2004
MICROCIRCUITS, MONOLITHIC SILICON, BIPOLAR, INTERFACE, MEMORY CORE DRIVERS
This specification covers the detail requirements for monolithic silicon, bipolar, interface, memory core drivers. Two product assurance classes and a choice of case outlines and lead finishes are...
April 2, 2001
MICROCIRCUITS, MONOLITHIC SILICON, BIPOLAR, INTERFACE, MEMORY CORE DRIVERS
A description is not available for this item.
July 10, 1995
MICROCIRCUITS, MONOLITHIC SILICON, BIPOLAR, INTERFACE, MEMORY CORE DRIVERS
A description is not available for this item.
October 22, 1987
MICROCIRCUITS, MONOLITHIC SILICON, BIPOLAR, INTERFACE, MEMORY CORE DRIVERS
A description is not available for this item.
June 6, 1986
MICROCIRCUITS, MONOLITHIC SILICON, BIPOLAR, INTERFACE, MEMORY CORE DRIVERS
A description is not available for this item.
MIL-M-38510/130
January 2, 1986
MICROCIRCUITS, MONOLITHIC SILICON, BIPOLAR, INTERFACE, MEMORY CORE DRIVERS
This specification covers the detail requirements for monolithic silicon bipolar interface memory core drivers. Two product assurance classes and a choice of case outline/lead finish are reflected in...
July 14, 1983
MICROCIRCUITS, MONOLITHIC SILICON, BIPOLAR, INTERFACE, MEMORY CORE DRIVERS
A description is not available for this item.
March 11, 1983
MICROCIRCUITS, MONOLITHIC SILICON, BIPOLAR, INTERFACE, MEMORY CORE DRIVERS
A description is not available for this item.
January 6, 1982
MICROCIRCUITS, MONOLITHIC SILICON, BIPOLAR, INTERFACE, MEMORY CORE DRIVERS
A description is not available for this item.

References

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