NPFC - MIL-M-38510/130
MICROCIRCUITS, MONOLITHIC SILICON, BIPOLAR, INTERFACE, MEMORY CORE DRIVERS
| Organization: | NPFC |
| Publication Date: | 2 January 1986 |
| Status: | inactive |
| Page Count: | 42 |
scope:
This specification covers the detail requirements for monolithic silicon bipolar interface memory core drivers. Two product assurance classes and a choice of case outline/lead finish are reflected in the complete part number.
The part number shall be in accordance with MIL-M-38510.
The device type shall be as follows:
Device type Circuit 01 Dual source and dual sink (positive-OR) 02 Quad sink (positive-OR) 03 Quad source/sink (positive-OR)
The device class shall be the product assurance level as defined in MIL-M-38510.
The case outline shall be designated as follows:
Letter Case outline, MIL-M-38510, Appendix C E D-2 (16-lead, ¼" × ⅞" dual-in-line package)
Supply voltage (VCC1) - - - - - - - - - - - - 7.0 V Supply voltage (VCC2) (device types 01, 03) - 25 V Input voltage (VIN) - - - - - - - - - - - - - 5.5 V Output collector voltage (VOCV) Device types 02, 03 - - - - - - - - - - - - 25 V Output clamp voltage (VOC) (device type 02) - 25 V Output collector current (IOC) - - - - - - - 750 mA Duty cycle for each output transistor - - - - 20% 1/ Continuous total dissipation at 25°C ambient - - - - - - - - - - - - - - - - 1375 mW Storage temperature range - - - - - - - - - - −65°C to +150°C Junction temperature (TJ) - - - - - - - - - - 150°C Lead temperature 1/16 inch from case, 60 seconds - - - - - - - - - - - - - - - - 300°C
Beneficial comments (recommendations, additions, deletions) and any pertinent data which may be of use in improving this document should be addressed to: Rome Air Development Center, (RBE-2), Griffiss AFB, NY 13441, by using the self-addressed Standardization Document Improvement Proposal (DD Form 1426) appearing at the end of this document or by letter.
Supply voltage range - - - - - - - - - - - - - 4.5 V to 5.5 V Ambient operating temperature range - - - - - - −55°C to +125°C
Maximum allowable Maximum Maxium Package Case outline power dissipation 2/ θJC θJA 16-lead dual-in-line package E 275 mW @ TA = 125°C 29°C/W 91°C/W
intended Use:
Microcircuits conforming to this specification are intended for original equipment design applications and logistic support of existing equipment.
Document History