scope:

This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN is as shown in the following example:

Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) identify the circuit function as follows:

Device type Generic number Circuit function 01 54ACT11 Triple 3-input positive-AND gate with TTL compatible inputs

The device class designator is a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535

The case outline(s) are as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style C GDIP1-T14 or CDIP2-T14 14 Dual-in-line D GDFP1-F14 or CDFP2-F14 14 Flat pack 2 CQCC1-N20 20 Square leadless chip carrier

The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M.

Supply voltage range (V_CC) . . . . . . . . . . . . . . . . . . . . . . . −0.5 V dc to +7.0 V dc DC input voltage range (V_IN) . . . . . . . . . . . . . . . . . . . . . . −0.5 V dc to V_CC +0.5 V dc 4/ DC output voltage range (V_OUT) . . . . . . . . . . . . . . . . . . . . . −0.5 V dc to V_CC +0.5 V dc 4/ DC input clamp current (I_IK) (V_IN < 0.0 V or V_IN > V_CC) . . . . . . . . ±20 mA DC output clamp current (I_OK)(V_OUT < 0.0 V or V_OUT > V_CC) . . . . . . . ±20 mA Continuous output current, (I_O) (V_OUT = 0.0 V to V_CC) . . . . . . . . . ±50 mA Continuous current through V_CC or GND . . . . . . . . . . . . . . . . . ±200 mA Maximum power dissipation (P_D) . . . . . . . . . . . . . . . . . . . . . 500 mW Storage temperature range (T_STG) . . . . . . . . . . . . . . . . . . . . −65°C to +150°C Lead temperature (soldering, 10 seconds) . . . . . . . . . . . . . . . . +300°C Thermal resistance, junction-to-case (Θ_JC) . . . . . . . . . . . . . . See MIL-STD-1835 Junction temperature (T_J) . . . . . . . . . . . . . . . . . . . . . . . +175°C

Supply voltage range (V_CC) . . . . . . . . . . . . . . . . . . . . . . . +4.5 V dc to +5.5 V dc Minimum high level input voltage (V_IH) . . . . . . . . . . . . . . . . . +2.0 V Maximum low level input voltage (V_IL) . . . . . . . . . . . . . . . . . +0.8 V Input voltage range (V_IN) . . . . . . . . . . . . . . . . . . . . . . . +0.0 V dc to V_CC Output voltage range (V_OUT) . . . . . . . . . . . . . . . . . . . . . . +0.0 V dc to V_CC Maximum high level output current (I_OH) . . . . . . . . . . . . . . . . −24 mA Maximum low level output current (I_OL) . . . . . . . . . . . . . . . . . +24 mA Input transition rise or fall rate (Δt/ΔV) . . . . . . . . . . . . . . 0 to 8 ns/V Operating case temperature range (T_C) . . . . . . . . . . . . . . . . . −55°C to +125°C

Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) . . . . . . . . . . . . . XX percent 5/

intended Use: