scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes Q and M) and space application (device class V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device class M RHA marked devices shall meet the MIL-I-38535 appendix A specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function 01 DG200 Dual SPST analog switch

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 Q or V Certification and qualification to MIL-I-38535

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style C GDIP1-T14 or CDIP2-T14 14 Dual-in-line package I MACY1-X10 10 Metal can

The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein) for class M or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Supply voltage (between V+ and V−). . . . . . . . . . . 44 V dc Digital input voltage (V_IN ) . . . . . . . . . . . . . . V− −2 V dc to V+ +2 V dc Analog input voltage (V_S) . . . . . . . . . . . . . . . V− −2 V dc to V+ +2 V dc Current (any terminal except S or D) . . . . . . . . . . 30 mA dc Continuous current, S or D . . . . . . . . . . . . . . . 30 mA dc Peak current, S or D (pulsed at 1 ms, 10 percent duty cycle maximum). . . . 100 mA dc Storage temperature range. . . . . . . . . . . . . . . . −65°C to +150°C Power dissipation (P_D) . . . . . . . . . . . . . . . . . 750 mW 2/ Lead temperature (soldering, 10 seconds) . . . . . . . . +275°C Thermal resistance, junction-to-case (Θ_JC) . . . . . . . See MIL-STD-1835 Junction temperature (T_J) . . . . . . . . . . . . . . . +150°C V+ to ground . . . . . . . . . . . . . . . . . . . . . . +25 V V− to ground . . . . . . . . . . . . . . . . . . . . . . −25 V

Positive supply voltage (V+) . . . . . . . . . . . . . . +15 V dc Negative supply voltage (V−) . . . . . . . . . . . . . . −15 V dc minimum digital high level input voltage (V_IH) . . . . . +2.4 V dc Maximum digital low level input voltage (V_IL). . . . . . +0.8 V dc Ambient operating temperature range (T_A). . . . . . . .. −55°C to +125°C

intended Use: