DLA - SMD-5962-91568 REV A
MICROCIRCUIT, MEMORY, DIGITAL, CMOS, ONE-TIME PROGRAMMABLE LOGIC ARRAY, MONOLITHIC SILICON
| Organization: | DLA |
| Publication Date: | 20 September 1993 |
| Status: | inactive |
| Page Count: | 23 |
scope:
This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes B, Q, and M) and space application (device classes S and V) and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available a choice of radiation hardness assurance (RHA) levels are reflected in the PIN.
The PIN shall be as shown in the following example:
Device classes M, B, and S RHA marked devices shall meet the MIL-M-38510 specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet or exceed the electrical performance characteristics specified in table I herein after exposure to the specified irradiation levels specified in the absolute maximum ratings herein and the RHA marked device shall be marked in accordance with MIL-I-38535. A dash (-) indicates a non-RHA device.
The device type(s) shall identify the circuit function as follows:
Device type Generic number 1/ Circuit function Access time 01 Generic 20-pin PLD 20 ns 02 Generic 20-pin PLD 15 ns
The device class designator shall be a single letter identifying the product assurance level as follows:
Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 B or S Certification and qualification to MIL-M-38510 Q or V Certification and qualification to MIL-I-38535
The case outline(s) shall be as designated in MIL-STD-1835 and as follows:
Outline letter Descriptive designator Terminals Package style R GDIP1-T20 or CDIP2-T20 20 Dual-in-line S GDFP2-F20 or CDFP3-F20 20 Flat pack X CQCC2-N20 20 Square leadless chip carrier
The Lead finish shall be as specified in MIL-M-38510 for classes M, B, and S or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.
Supply voltage range to ground potential (VCC)- - - - - −0.5 V dc to +7.0 V dc DC voltage applied to the outputs in the high Z state - −0.5 V dc to +7.0 V dc DC input voltage- - - - - - - - - - - - - - - - - - - - −3.0 V dc to +7.0 V dc Maximum power dissipation - - - - - - - - - - - - - - - 1.0 W 4/ Lead temperature (soldering, 10 seconds)- - - - - - - - +260°C Thermal resistance, junction-to-case (θJC)- - - - - - - See MIL-STD-1835 Junction temperature (TJ) - - - - - - - - - - - - - - - +175°C Storage temperature range (TSTG)- - - - - - - - - - - - −65°C to +150°C Temperature under bias- - - - - - - - - - - - - - - - - −55°C to +125°C Output current into outputs (low) - - - - - - - - - - - 24 mA
Supply voltage range (VCC)- - - - - - - - - - - - - - - +4.5 V dc minimum to +5.5 V dc maximum Ground voltage (GND)- - - - - - - - - - - - - - - - - - 0.0 V dc Input high voltage (VIH)- - - - - - - - - - - - - - - - 2.0 V dc minimum 5/ Input low voltage (VIL) - - - - - - - - - - - - - - - - 0.8 V dc maximum 5/ Case operating temperature range (TC) - - - - - - - - - −55°C to +125°C
Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012)- - - - - - 6/ percent
intended Use:
Microcircuits conforming to this drawing are intended for use for government microcircuit applications (original equipment) , design applications, and logistics purposes.
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